Kim, Joonsuk
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1

Intermolecular lithium bonding between different components..:

Song, Seon Bin ; Sim, Myungsun ; Ki, Min Seok...
Journal of Materials Chemistry C.  12 (2024)  15 - p. 5469-5479 , 2024
 
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2

Optimizing Embryo Collection for Application of CRISPR/Cas9..:

Seol, Dong-Won ; Park, Byoung-Jin ; Koo, Deog-Bon...
Current Issues in Molecular Biology.  46 (2024)  5 - p. 3752-3762 , 2024
 
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3

A 4-nm 16-Gb/s/pin Single-Ended PAM-4 Parallel Transceiver ..:

Jin, Jahoon ; Lee, Soo-Min ; Min, Kyunghwan...
IEEE Journal of Solid-State Circuits.  59 (2024)  1 - p. 184-195 , 2024
 
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4

Pinacolborane-assisted superacid organocatalysis enabled di..:

Kim, Woo Hee ; Song, Seon Bin ; Lee, Da Eun...
Cell Reports Physical Science.  5 (2024)  2 - p. 101786 , 2024
 
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5

A Design Space for Intelligent and Interactive Writing Assi..:

, In: Proceedings of the CHI Conference on Human Factors in Computing Systems,
 
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7

31.2 A Fully Integrated IEEE 802.15.4/4z-Compliant 6.5-to-8..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Kim, Wan ; Seok, Hyun-Gi ; Lee, Geunhaeng... - p. 462-464 , 2023
 
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8

Machine Learning-Aided Dual CSI Feedback in Next Generation..:

, In: 2023 IEEE 97th Vehicular Technology Conference (VTC2023-Spring),
Jeon, Eunsung ; Lee, Wook Bong ; Ahn, Minki... - p. 1-6 , 2023
 
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10

Numerical investigation and Pareto optimization on performa..:

Bae, Jeongtae ; Ju, Kangmin ; Kim, Joonsuk.
International Journal of Hydrogen Energy.  48 (2023)  27 - p. 10272-10287 , 2023
 
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12

A 4nm 16Gb/s/pin Single-Ended PAM4 Parallel Transceiver wit..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Jin, Jahoon ; Lee, Soo-Min ; Min, Kyunghwan... - p. 1-3 , 2023
 
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13

AMPK reduces macrophage endotoxin tolerance through inhibit..:

Yin, Mei ; Kim, Joungmin ; Choi, Jeong-Il...
International Immunopharmacology.  118 (2023)  - p. 110146 , 2023
 
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14

A Fully Integrated IEEE 802.15.4/4z-Compliant UWB System-on..:

Kim, Wan ; Seok, Hyun-Gi ; Lee, Geunhaeng...
IEEE Journal of Solid-State Circuits.  58 (2023)  12 - p. 3408-3420 , 2023
 
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