E-LIB Suche - Ergebnisse für: Lo, Tsung-Tien

1

Syndromic ciliopathy: a taiwanese single-center study:

Pan, Yu-Wen ; Ou, Tsung-Ying ; Chou, Yen-Yin...
BMC Medical Genomics. 17 (2024) 1 - p. , 2024

Link: https://doi.org/10.1186/..

2

Decomposing and simplifying the Fracture Risk Assessment To..:

Li, Chia-Chun ; Liu, I-Ting ; Cheng, Tien-Tsai...
JBMR Plus. 8 (2024) 5 - p. , 2024

Link: https://doi.org/10.1093/..

3

Auxiliary Diagnosis of Dental Calculus Based on Deep Learni..:

Lin, Tai-Jung ; Lin, Yen-Ting ; Lin, Yuan-Jin...
Bioengineering. 11 (2024) 7 - p. 675 , 2024

Link: https://doi.org/10.3390/..

4

Comparison of the 2022 world health organization classifica..:

Lee, Wan-Hsuan ; Lin, Chien-Chin ; Tsai, Cheng-Hong...
Blood Cancer Journal. 14 (2024) 1 - p. , 2024

Link: https://doi.org/10.1038/..

5

Efficacy, safety, and pharmacokinetics of capsid assembly m..:

Hou, Jinlin ; Gane, Edward ; Balabanska, Rozalina...
Clinical and Molecular Hepatology. 30 (2024) 2 - p. 191-205 , 2024

Link: https://doi.org/10.3350/..

6

A Nonvolatile AI-Edge Processor With SLC–MLC Hybrid ReRAM C..:

Hsu, Hung-Hsi ; Wen, Tai-Hao ; Huang, Wei-Hsing...
IEEE Journal of Solid-State Circuits. 59 (2024) 1 - p. 116-127 , 2024

Link: https://doi.org/10.1109/..

7

A New ICT Architecture of Smart Water Network Platform for ..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),

Li, Chien-Hsing ; Chou, Hao-Tien ; Wu, Chun-I. - p. 157-159 , 2024

Link: https://doi.org/10.1109/..

8

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),

Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024

Link: https://doi.org/10.1109/..

9

Microbiota signatures associated with invasive Candida albi..:

Yan, Jia-Ying ; Lin, Tsung-Han ; Jong, Yu-Tang...
Frontiers in Cellular and Infection Microbiology. 13 (2024) - p. , 2024

Link: https://doi.org/10.3389/..

10

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024

Link: https://doi.org/10.1109/..

11

Compositional asymmetry in a crystalline–amorphous block co..:

Wu, Kuang-Hsin ; Hsieh, Chia-Pei ; Lo, Chieh-Tsung
Soft Matter. 20 (2024) 21 - p. 4308-4318 , 2024

Link: https://doi.org/10.1039/..

12

An 8b-Precision 8-Mb STT-MRAM Near-Memory-Compute Macro Usi..:

You, De-Qi ; Chiu, Yen-Cheng ; Khwa, Win-San...
IEEE Journal of Solid-State Circuits. 59 (2024) 1 - p. 219-230 , 2024

Link: https://doi.org/10.1109/..

13

34.4 A 3nm, 32.5TOPS/W, 55.0TOPS/mm2 and 3.78Mb/mm2 Fully-D..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),

Fujiwara, Hidehiro ; Mori, Haruki ; Zhao, Wei-Chang... - p. 572-574 , 2024

Link: https://doi.org/10.1109/..

14

Deciphering DED assembly mechanisms in FADD-procaspase-8-cF..:

Yang, Chao-Yu ; Lien, Chia-I ; Tseng, Yi-Chun...
Nature Communications. 15 (2024) 1 - p. , 2024

Link: https://doi.org/10.1038/..

15

Effects of Channel Thickness on DC/RF Performance of InAlGa..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),

Shieh, De ; Lee, Zheng-Fong ; Lee, Ming-Yuan... - p. 1-2 , 2024

Link: https://doi.org/10.1109/..