Syu, Jin-Yuan
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1

Solder Joint Lifetime Characterization of a SiC Power MOSFE..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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4

Hydrophilic Ligand Exchange Induces Improved Upconversion N..:

Liu, Bo-Tau ; Syu, Jin-Ci ; Mizota, Isao...
ACS Applied Energy Materials.  7 (2024)  3 - p. 965-973 , 2024
 
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5

Electrogelated drug-embedded silk/gelatin/rGO degradable el..:

Lin, Zhen-Kai ; Lin, Jing-Syu ; Chen, Zih-Huei...
Journal of Materials Chemistry B.  12 (2024)  5 - p. 1361-1371 , 2024
 
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7

BAPCP: A comprehensive and user-friendly web tool for ident..:

Yang, Tzu-Hsien ; Syu, Guan-Da ; Chen, Chien-Sheng...
Computer Methods and Programs in Biomedicine.  254 (2024)  - p. 108260 , 2024
 
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8

Comprehensive Influences of Manufacturing Process Integrate..:

Lee, Chang-Chun ; Wang, Chi-Wei ; Syu, Ji-Yuan.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  5 - p. 824-831 , 2024
 
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9

Power Cycling Modeling and Lifetime Evaluation of SiC Power..:

Cheng, Hsien-Chie ; Syu, Ji-Yuan ; Wang, He-Hong...
IEEE Transactions on Device and Materials Reliability.  24 (2024)  1 - p. 142-153 , 2024
 
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11

The Development of 1.7kV 100A SiC MOSFET Power Module for A..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
 
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12

Prediction and optimization of frying conditions of air fri..:

Chan, Der-Sheng ; Victor Lin, Hong-Ting ; Huang, Yu-Hsiang..
International Journal of Gastronomy and Food Science.  34 (2023)  - p. 100837 , 2023
 
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15

IANS: Intelligibility-Aware Null-Steering Beamforming for D..:

, In: 2023 IEEE 33rd International Workshop on Machine Learning for Signal Processing (MLSP),
Ting, Wen-Yuan ; Wang, Syu-Siang ; Tsao, Yu. - p. 1-6 , 2023
 
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