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Xianjia Huang
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1

Genetically Engineered Cytomembrane Nanovaccines for Cancer..:

Pan, Yuanwei ; Wu, Xianjia ; Liu, Lujie...
Advanced Healthcare Materials.  13 (2024)  13 - p. , 2024
Link: https://doi.org/10.1002/..
 
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2

Effect of thermal impact on the onset and propagation of th..:

Liu, Yanhui ; Zhang, Lei ; Ding, Yifei..
Renewable Energy.  222 (2024)  - p. 119910 , 2024
Link: https://doi.org/10.1016/..
 
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3

Laser-induced thermal runaway dynamics of cylindrical lithi..:

Liu, Yanhui ; Zhang, Lei ; Huang, Xianjia..
Journal of Energy Storage.  86 (2024)  - p. 111337 , 2024
Link: https://doi.org/10.1016/..
 
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4

Stress-strain analysis and optimization of laminated solder..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Liye ; Huang, Chunyue ; Liu, Xiaobin... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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5

Influence mechanism of temperature field inside the cable o..:

Peng, Lan ; Huang, Xianjia ; Wang, Jinkai.
Fire Safety Journal.  141 (2023)  - p. 103972 , 2023
Link: https://doi.org/10.1016/..
 
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6

Stress-strain analysis and optimization of TSV interconnect..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Lilin ; Huang, Chunyue ; Wu, Liye... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

Experimental studies on sidewall pool fire for assessing gr..:

Huang, Xianjia ; Wang, Jinkai ; Zhu, He...
Case Studies in Thermal Engineering.  49 (2023)  - p. 103298 , 2023
Link: https://doi.org/10.1016/..
 
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8

Study of TSV Interconnection Structure Based on Coupled Hig..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Bin ; Huang, Chunyue ; Gao, Chao... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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9

Analysis of torsional stresses in POP solder joints under c..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Jiahua ; Huang, Chunyue ; Yin, Shupei... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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10

Effects of vent layout and vent area on dynamic characteris..:

Zhang, Qiang ; Chen, Guohua ; Huang, Xianjia...
Journal of Loss Prevention in the Process Industries.  83 (2023)  - p. 105051 , 2023
Link: https://doi.org/10.1016/..
 
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11

Stress analysis and geometrical parameter optimization of L..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Lan, Jingyi ; Huang, Chunyue ; Yin, Shupei.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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12

Thermal stress analysis and optimization of BGA stacked sol..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xianjia ; Huang, Chunyue ; Wang, Lilin... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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13

Optimization of stress and related parameters of BGA solder..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Junjian ; Huang, Chunyue ; Li, Shuyi... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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14

Heat transfer from the wall-attached flame to the sidewall ..:

Xing, Chaoliang ; Huang, Xianjia ; Wang, Jinkai...
International Journal of Thermal Sciences.  184 (2023)  - p. 107918 , 2023
Link: https://doi.org/10.1016/..
 
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15

Au- or Ag-Decorated ZnO-Rod/rGO Nanocomposite with Enhanced..:

Huang, Ke ; Lu, Junfeng ; Li, Donglin...
Nanomaterials.  13 (2023)  16 - p. 2370 , 2023
Link: https://doi.org/10.3390/..
 
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