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X
Hsieh, Yun Chen
639  results:
Bookchapter (Online) X
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1

UV-VIS Dual-band Method for Optical Refractive Index Measur..:

, In: 2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI),
Liu, Yung-Fu ; Hsieh, Ya-Hui ; Yeh, Feng-Ming... - p. 373-376 , 2024
Link: https://doi.org/10.1109/..
 
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2

Effects of Channel Thickness on DC/RF Performance of InAlGa..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shieh, De ; Lee, Zheng-Fong ; Lee, Ming-Yuan... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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3

PRESS: Persistence Relaxation for Efficient and Secure Data..:

, In: 2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC),
Hsieh, Yun-Shan ; Chen, Bo-Jun ; Huang, Po-Chun. - p. 341-348 , 2024
Link: https://doi.org/10.1109/..
 
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4

Using Virtual Reality to Enhance Agricultural Value of Came..:

, In: 2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI),
Hsieh, Yun-Hsiang ; Tsai, Hung-Cheng - p. 355-358 , 2024
Link: https://doi.org/10.1109/..
 
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5

An Energy-efficient Si-integrated Micro-cooler for High Pow..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lien, Yu-Jen ; Hsieh, Cheng-Chieh ; Ku, Terry... - p. 1025-1029 , 2024
Link: https://doi.org/10.1109/..
 
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6

Quantitative Elemental Characterization for Electroless Cu ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Nishijima, Masahiko ; Hsieh, Ming-Chun ; Zheng, Zhang... - p. 11-12 , 2024
Link: https://doi.org/10.23919..
 
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7

The Human-Computer Dynamic Structural Analysis of Interacti..:

, In: Cross-Cultural Design; Lecture Notes in Computer Science,
Chen, Yun-Ju ; Hsieh, Tsuei-Ju - p. 37-46 , 2024
Link: https://doi.org/10.1007/..
 
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8

On DRC Cleanness of Cell Porting for Design Migrations in F..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wang, Ching-Ying ; Chen, Chen-Ho ; Chang, Po-Hsiang... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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9

Next Generation Large Size High Interconnect Density CoWoS-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Chien-Hsun ; Hu, YH ; Chen, SM... - p. 259-263 , 2024
Link: https://doi.org/10.1109/..
 
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10

High Performance Antenna-in-Package with Test Socket for Mi..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Ho, Cheng-Yu ; Hsiao, Wen-Chun ; Hsieh, Sheng-Chi.. - p. 191-192 , 2024
Link: https://doi.org/10.23919..
 
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11

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Eng..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Shih, Ming-En ; Hsieh, Shih-Wei ; Tsai, Ping-Yuan... - p. 360-362 , 2024
Link: https://doi.org/10.1109/..
 
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12

Covid-19 Detection Based on Chest X-ray Images Using Attent..:

, In: Engineering Cyber-Physical Systems and Critical Infrastructures; Artificial Intelligence for Internet of Things (IoT) and Health Systems Operability,
Chen, Huan ; Hsieh, Jia‐You ; Hsu, Hsin-Yao. - p. 104-115 , 2024
Link: https://doi.org/10.1007/..
 
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13

Contributors:

, In: Federated Learning,
Agussurja, Lucas ; Aramoon, Omid ; Arora, Sanjeev... - p. xvii-xxi , 2024
Link: https://doi.org/10.1016/..
 
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14

Feature Points based Residual UNet with Nonlinear Decay Rat..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Hsieh, An-Ting ; Chiu, Ching-Te ; Chen, Tsai-Chieh.. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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15

A Compact AiP with a Dual-Polarized 1x4 Antenna Array for 5..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsieh, Sheng-Chi ; Huang, Hong-Sheng ; Hsiao, Wen-Chun... - p. 189-190 , 2024
Link: https://doi.org/10.23919..
 
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