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X
Lu, Shih-Yuan
384  results:
Bookchapter (Online) X
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1

High Speed Signal Design on Fan-Out RDL Interposer for Arti..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhuang, Ming-Han ; Shih, Chih-Yuan ; Lin, Ho-Chuan.. - p. 275-276 , 2024
Link: https://doi.org/10.23919..
 
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2

Virtual reality based Neural Sensors with Respirator for Ca..:

, In: 2024 9th IEEE International Conference on Smart Cloud (SmartCloud),
Lu, Yun-En ; Yeh, Shih-Ching ; Wu, Eric Hsiao-Kuang.. - p. 86-91 , 2024
Link: https://doi.org/10.1109/..
 
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3

Discussion of User Experience for Streaming Platform by Usi..:

, In: Culture and Computing; Lecture Notes in Computer Science,
Lu, Shih-Yun ; Hsieh, Wei-Her ; Ku, Chang Yuan - p. 74-89 , 2024
Link: https://doi.org/10.1007/..
 
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4

Design of an Efficient Deep Neural Network Accelerator Base..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Hsiao, Shen-Fu ; Lin, Sin-Chen ; Chen, Guan-Lin... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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5

Si Multi-Bridge Channel CMOS Inverter with Five Stacked Lay..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Chang, Wei-Yuan ; Luo, Guang-Li ; Chu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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6

Dynamic-Superb: Towards a Dynamic, Collaborative, and Compr..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Huang, Chien-Yu ; Lu, Ke-Han ; Wang, Shih-Heng... - p. 12136-12140 , 2024
Link: https://doi.org/10.1109/..
 
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7

Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 399-403 , 2024
Link: https://doi.org/10.1109/..
 
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8

Convolutional Probabilistic Neural Network Approach for Fau..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Yen, Sheng-Chao ; Hsieh, Cheng-Yu ; Shih, Tung-Ting... - p. 01-03 , 2024
Link: https://doi.org/10.1109/..
 
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9

An Intelligent Thermal Compensation System Using Edge Compu..:

, In: Frontier Computing on Industrial Applications Volume 4; Lecture Notes in Electrical Engineering,
Wang, Lu-Yan ; Liu, Jung-Chun ; Huang, Cheng-Kai.. - p. 96-102 , 2024
Link: https://doi.org/10.1007/..
 
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10

Laser Applications in Power Management IC Packaging:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lu, Wei-Yu ; Wu, Shih-Jeh ; Hsu, Hsiang-Chen. - p. 89-90 , 2024
Link: https://doi.org/10.23919..
 
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11

An Exploration of Multimodal Communication for Developing E..:

, In: Companion of the 2024 ACM/IEEE International Conference on Human-Robot Interaction,
Lu, Wen-I ; Chien, Shih-Yi ; Chan, Yao-Cheng - p. 702-706 , 2024
Link: https://dl.acm.org/doi/1..
 
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12

Dynamic Channel Switching and Transition Frequency Scheme f..:

, In: 2024 IEEE Wireless Communications and Networking Conference (WCNC),
Chen, Yun-Tai ; Shih, Yuan-Yao - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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13

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Eng..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Shih, Ming-En ; Hsieh, Shih-Wei ; Tsai, Ping-Yuan... - p. 360-362 , 2024
Link: https://doi.org/10.1109/..
 
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14

TGV drilling by Ultrafast Laser with Hollow Beam Optics:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsu, Hsiang-Chen ; Wu, Shih-Jeh ; Lu, Wei-Yu. - p. 69-70 , 2024
Link: https://doi.org/10.23919..
 
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15

A Robust Coverless Image Steganography Method Based on Face..:

, In: 2024 4th Asia Conference on Information Engineering (ACIE),
Lu, Shih-Yu ; Lin, Chen-Yi - p. 52-57 , 2024
Link: https://doi.org/10.1109/..
 
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