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2024 International Conference on Electronics Packaging (ICEP) ,
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High Speed Signal Design on Fan-Out RDL Interposer for Arti..:
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2024 9th IEEE International Conference on Smart Cloud (SmartCloud) ,
2
Virtual reality based Neural Sensors with Respirator for Ca..:
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Culture and Computing; Lecture Notes in Computer Science ,
3
Discussion of User Experience for Streaming Platform by Usi..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
4
Design of an Efficient Deep Neural Network Accelerator Base..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
5
Si Multi-Bridge Channel CMOS Inverter with Five Stacked Lay..:
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ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
6
Dynamic-Superb: Towards a Dynamic, Collaborative, and Compr..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
7
Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:
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2024 10th International Conference on Applied System Innovation (ICASI) ,
8
Convolutional Probabilistic Neural Network Approach for Fau..:
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Frontier Computing on Industrial Applications Volume 4; Lecture Notes in Electrical Engineering ,
9
An Intelligent Thermal Compensation System Using Edge Compu..:
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2024 International Conference on Electronics Packaging (ICEP) ,
10
Laser Applications in Power Management IC Packaging:
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Companion of the 2024 ACM/IEEE International Conference on Human-Robot Interaction ,
11
An Exploration of Multimodal Communication for Developing E..:
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2024 IEEE Wireless Communications and Networking Conference (WCNC) ,
12
Dynamic Channel Switching and Transition Frequency Scheme f..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
13
20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Eng..:
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2024 International Conference on Electronics Packaging (ICEP) ,
14
TGV drilling by Ultrafast Laser with Hollow Beam Optics:
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2024 4th Asia Conference on Information Engineering (ACIE) ,
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