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Chao, Ching-Hsiang
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1

LASER light scribe and microwave annealing reduction of gra..:

, In: 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems,
Ka Hing Cheng ; Cheng, Ching-Hsiang ; Kuo-An Chao, Andy. - p. 380-383 , 2015
Link: https://doi.org/10.1109/..
 
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2

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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3

A Fully Integrated End-to-End Genome Analysis Accelerator f..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Chen, Yen-Lung ; Yang, Chung-Hsuan ; Wu, Yi-Chung... - p. 44-46 , 2023
Link: https://doi.org/10.1109/..
 
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4

A Real-time Artificial Intelligence Recognition System on C..:

, In: 2022 IEEE International Conference on Mechatronics and Automation (ICMA),
Chiang, Cheng-Ta ; Wu, Yu-Hsiang ; Chao, Ching-Hsien - p. 1057-1061 , 2022
Link: https://doi.org/10.1109/..
 
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5

Radiation-Harden RISC Processor for Micro-Satellites in Sta..:

, In: 2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT),
Chiueh, Herming ; Yang, Chia-Hsiang ; Wen, Charles H.-P.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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6

The Open Data and Voices of Social Communities : Case of..:

, In: Proceedings of the 5th Multidisciplinary International Social Networks Conference,
Chao, Chian-Hsueng ; Lin, Chia-Pei ; Peng, Te-Hsin.. - p. 1-8 , 2018
Link: https://dl.acm.org/doi/1..
 
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7

List of Contributors:

, In: Big Data Analytics for Sensor-Network Collected Intelligence,
Anbar, Ahmad ; Assem, Haytham ; Blanchet, Christophe... - p. xiii-xv , 2017
Link: https://doi.org/10.1016/..
 
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8

Distinguishing Handwritten from Printed Content on Quiz She..:

, In: Proceedings of the 2024 9th International Conference on Multimedia and Image Processing,
Wei, Yu-Jen ; Liu, Chen ; Chang, Ching-Hsiang. - p. 113-118 , 2024
Link: https://dl.acm.org/doi/1..
 
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9

Towards System-Friendly Solid-State Circuit Breaker for Ele..:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
Qin, Dehao ; Zhang, Zheyu ; Dam, Shimul K... - p. 3108-3114 , 2024
Link: https://doi.org/10.1109/..
 
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10

0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ma, Kai ; Bekiaris, Nikolaos ; Hsu, Ching-Hsiang... - p. 331-336 , 2024
Link: https://doi.org/10.1109/..
 
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11

High Bandwidth Efficiency FPGA-based Underwater Acoustic Tr..:

, In: 2023 20th International SoC Design Conference (ISOCC),
Lee, Tzung-Je ; Chang, Hung-Hsiang ; Chao, Chien-Hsiang - p. 39-40 , 2023
Link: https://doi.org/10.1109/..
 
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12

High Current Turn-off of GaN HEMT for Solid-state Circuit B..:

, In: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC),
Dong, Zhou ; Yang, Ching-Hsiang ; Dam, Shimul K.... - p. 656-660 , 2023
Link: https://doi.org/10.1109/..
 
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13

Paralleling 650 V/150 A GaN HEMTs for Cryogenically Cooled ..:

, In: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC),
Yang, Ching-Hsiang ; Dong, Zhou ; Dam, Shimul K.... - p. 2520-2525 , 2023
Link: https://doi.org/10.1109/..
 
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14

Module Development of a High-Power-Density High-Efficiency ..:

, In: 2023 IEEE Energy Conversion Congress and Exposition (ECCE),
Dam, Shimul K. ; Yang, Ching-Hsiang ; Dong, Zhou... - p. 1996-2001 , 2023
Link: https://doi.org/10.1109/..
 
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15

Piezo-Electret Capacitive Micromachined Ultrasonic Transduc..:

, In: 2023 2nd International Symposium on Sensor Technology and Control (ISSTC),
Wang, Zelin ; Chin, Chi-Te ; Cheng, Ching-Hsiang - p. 114-118 , 2023
Link: https://doi.org/10.1109/..
 
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