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Chieh-Hsing Liu
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1

GaN on Si RF performance with different AlGaN back barrier:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hsieh, Chang-Yan ; Chen, Hui-Yu ; Tu, Po-Tsung... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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2

A Novel High Electric Field EMS Probe for Automotive and Co..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Peng, Hsing-Chuan ; Wu, Sung-Mao ; Chang, Ming-Cheng. - p. 35-36 , 2024
Link: https://doi.org/10.23919..
 
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3

15.2 A 28nm 64Kb Inference-Training Two-Way Transpose Multi..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Su, Jian-Wei ; Si, Xin ; Chou, Yen-Chi... - p. 240-242 , 2020
Link: https://doi.org/10.1109/..
 
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4

18.6 A 0.5nJ/pixel 4K H.265/HEVC codec LSI for multi-format..:

, In: 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers,
Ju, Chi-Cheng ; Liu, Tsu-Ming ; Lee, Kun-Bin... - p. 1-3 , 2015
Link: https://doi.org/10.1109/..
 
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5

Zero current detection technique for fast transient respons..:

, In: 2008 IEEE International Symposium on Circuits and Systems (ISCAS),
Chi-Lin Chen ; Wei-Jen Lai ; Ter-Hsing Liu. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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6

Low-threshold deep-blue organic thin-film distributed feedb..:

, In: 2007 European Conference on Lasers and Electro-Optics and the International Quantum Electronics Conference,
Cheng, Hsing-chieh ; Lin, Hao-Wu ; Wu, Chung-Chih.. - p. None , 2007
Link: https://doi.org/10.1109/..
 
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7

Hardware Engine of Limbus Circle Matching for Visible-Spect..:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),
Kao, Wen-Chung ; Liu, Hsing-Hua ; Hong, Kai-Dun. - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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8

Reliable Study For Fine Line RDL Fan Out Multi Chip Module:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Jolin ; Tsai, Mike ; Liu, Bradley... - p. 01-04 , 2023
Link: https://doi.org/10.1109/..
 
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9

Reliability of Heterogeneous Integration on Hybrid Substrat..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yang, Channing Cheng-Lin ; Lau, John H ; Peng, Andy Yan-Jia... - p. 542-547 , 2023
Link: https://doi.org/10.1109/..
 
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10

2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Hete..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chen, Gary Chang-Fu ; Lau, John H ; Yang, Channing Cheng-Lin... - p. 30-37 , 2022
Link: https://doi.org/10.1109/..
 
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11

A Topology Optimization Method to Synthesize Geometrically ..:

, In: Advances in Mechanism and Machine Science; Mechanisms and Machine Science,
Liu, Chih-Hsing ; Chen, Ta-Lun ; Chung, Fu-Ming. - p. 259-268 , 2023
Link: https://doi.org/10.1007/..
 
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12

A Study on the Application of Geospatial Analysis to the As..:

, In: Lecture Notes in Electrical Engineering; Frontier Computing,
Liaw, Horng-Twu ; Liu, Fang-Hsing ; Lio, Kuan-Wen - p. 119-129 , 2023
Link: https://doi.org/10.1007/..
 
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13

Highly stable BiFeO3 RRAM with multilevel storage applicati..:

, In: International Conference on Innovation, Communication and Engineering (ICICE 2023),
Chen, Shih-Hsiang ; Young, Sheng-Joue ; Yang, Chih-Chiang. - p. None , 2023
Link: https://doi.org/10.1049/..
 
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14

Design of a Magnetic Probe for Land Subsidence Monitoring:

, In: 2022 IEEE International Conference on Consumer Electronics - Taiwan,
Pai, Tzu-Yang ; Wu, Tsung-Hsun ; Liu, Chih-Hsing. - p. 477-478 , 2022
Link: https://doi.org/10.1109/..
 
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15

CMOS-compatible GaN HEMT on 200mm Si-substrate for RF appli..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Yeh, Po-Chun ; Tu, Po-Tsung ; Liu, Hsueh-Hsing... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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