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Cho, Youngmin
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1

Development of an Intelligent Information Index Model for L..:

, In: Proceedings of the 21st Annual International Conference on Digital Government Research,
Sung, Wookjoon ; Hong, Kil Pyo ; Cho, Youngmin. - p. 267-274 , 2020
Link: https://dl.acm.org/doi/1..
 
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2

Learning dictionaries of stable autoregressive models for a..:

, In: Proceedings of the 26th Annual International Conference on Machine Learning,
Cho, Youngmin ; Saul, Lawrence K. - p. 169-176 , 2009
Link: https://dl.acm.org/doi/1..
 
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3

GeSn Laser Technologies for Integrated Photonics:

, In: 2022 IEEE Photonics Society Summer Topicals Meeting Series (SUM),
Shi, Xuncheng ; Burt, Daniel ; Kim, Youngmin... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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4

A Single-Path Digital-IF Receiver Supporting Inter/Intra 5-..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Sung, Barosaim ; Seok, Hyun-Gi ; Kim, Jaekwon... - p. 440-442 , 2022
Link: https://doi.org/10.1109/..
 
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5

Data extraction from flash memory and reverse engineering u..:

, In: 2022 19th International SoC Design Conference (ISOCC),
Lee, Dongchan ; Lee, Sanghyun ; Cho, Mannhee.. - p. 330-331 , 2022
Link: https://doi.org/10.1109/..
 
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6

A 60-Gb/s/pin single-ended PAM-4 transmitter with timing sk..:

, In: 2022 IEEE Custom Integrated Circuits Conference (CICC),
Kim, Joohwan ; Park, Junyoung ; Byun, Jindo... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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7

A 40-Gb/s/pin Low-Voltage POD Single-Ended PAM-4 Transceive..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Rie, Hyunsub Norbert ; Yoon, Chang Soo ; Byun, Jindo... - p. 148-149 , 2022
Link: https://doi.org/10.1109/..
 
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8

Automated Reverse Engineering Tools for FPGA Bitstream Extr..:

, In: 2022 19th International SoC Design Conference (ISOCC),
Cho, Mannhee ; Lee, Dongchan ; Lee, Sanghyun.. - p. 328-329 , 2022
Link: https://doi.org/10.1109/..
 
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9

List of Contributors:

, In: Child Neurology,
Aaen, Gregory ; Abroms, Israel F. ; Ådén, Ulrika... - p. ix-xi , 2021
Link: https://doi.org/10.1016/..
 
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10

Impact of Chip, Package, and Set Design on Transient Temper..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Yoo, Jongkyu ; Im, Yunhyeok ; Lee, Heeseok... - p. 229-235 , 2020
Link: https://doi.org/10.1109/..
 
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11

Thermal Sensor Placement based on Meta-Model Enhancing Obse..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Im, Yunhyeok ; Kim, Wook ; An, Taekeun... - p. 776-782 , 2020
Link: https://doi.org/10.1109/..
 
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12

Implementation of Data-optimized FPGA-based Accelerator for..:

, In: 2020 International Conference on Electronics, Information, and Communication (ICEIC),
Cho, Mannhee ; Kim, Youngmin - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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13

Nanoelectromechanical Memory Switch based Ternary Content-A..:

, In: 2020 International SoC Design Conference (ISOCC),
Cho, Mannhee ; Kim, Youngmin - p. 274-275 , 2020
Link: https://doi.org/10.1109/..
 
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14

Low Power Approximate Multiplier Using Error Tolerant Adder:

, In: 2020 International SoC Design Conference (ISOCC),
Cho, Jaeik ; Kim, Youngmin - p. 298-299 , 2020
Link: https://doi.org/10.1109/..
 
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15

Thermal Aware 3-D Floorplanning on Multi-stacked Board of S..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Cho, Youngsang ; Choi, Heejung ; Lee, Heeseok... - p. 636-641 , 2020
Link: https://doi.org/10.1109/..
 
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