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Hicks, L. A.
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1

Intel PowerVia Technology: Backside Power Delivery for High..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hafez, W. ; Agnihotri, P. ; Asoro, M.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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2

E-Core Implementation in Intel 4 with PowerVia (Backside Po..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Shamanna, M. ; Abuayob, E. ; Aenuganti, G.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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3

Reliability Modeling of Middle-Of-Line Interconnect Dielect..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Kasim, R. ; Lin, C. ; Perini, C.... - p. 1-8 , 2023
Link: https://doi.org/10.1109/..
 
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4

Novel Cell Architectures with Back-side Transistor Contacts..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kobrinsky, M. ; Silva, J. D ; Mannebach, E.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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5

Process Innovations for Future Technology Nodes with Back-S..:

, In: 2023 International Electron Devices Meeting (IEDM),
Kobrinsky, M. ; Silva, J. D ; Mannebach, E.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Understanding Effects of Operating Parameters on Plasma Cat..:

, In: 2022 IEEE International Conference on Plasma Science (ICOPS),
Akintola, I. ; Rivera-Castro, G. ; Yang, J... - p. 1-1 , 2022
Link: https://doi.org/10.1109/..
 
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7

Modeling Framework for Transistor Aging Playback in Advance..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Meric, I. ; Ramey, S. ; Novak, S.... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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8

Reliability Characteristics of a High Density Metal- Insula..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Lin, C.-Y. ; Avci, U. E. ; Blount, M. A.... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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9

A 45nm Logic Technology with High-k+Metal Gate Transistors,..:

, In: 2007 IEEE International Electron Devices Meeting,
Mistry, K. ; Chau, R. ; Choi, C.-H.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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10

Performance modelling for the National ERTMS Programme (NEP:

, In: The IEE Seminar on Railway System Modelling - Not Just for Fun, 2004.,
Hicks, D. - p. 61,62,63,64,65,66,67,68,69,70,71,72,73,74 , 2004
Link: https://doi.org/10.1049/..
 
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11

3.2. Satisfaction of Paramedical Personnel:

, In: Telemedicine and Teledermatology; Current Problems in Dermatology,
Hicks, L.L. - p. 58-61 , 2002
Link: https://doi.org/10.1159/..
 
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12

A review of tele-immersive applications in the CAVE researc..:

, In: Proceedings IEEE Virtual Reality (Cat. No. 99CB36316),
Leigh, J. ; Curry, K. ; Curtis, J.... - p. 180,181,182,183,184,185,186,187 , 1999
Link: https://doi.org/10.1109/..
 
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13

SRAM Imprinting for System Protection and Differentiation:

, In: Proceedings of the 19th ACM Asia Conference on Computer and Communications Security,
Mahmod, Jubayer ; Hicks, Matthew - p. 453-466 , 2024
Link: https://dl.acm.org/doi/1..
 
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14

Mitigating Deep Reinforcement Learning Backdoors in the Neu..:

, In: 2024 IEEE Security and Privacy Workshops (SPW),
Vyas, Sanyam ; Hicks, Chris ; Mavroudis, Vasilios - p. 76-86 , 2024
Link: https://doi.org/10.1109/..
 
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15

Simulating the post-earthquake morphological response of th..:

, In: 2024 International Conference on Machine Intelligence for GeoAnalytics and Remote Sensing (MIGARS),
Mead, Stuart ; Hicks, Murray ; Davies, Tim - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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