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Hsu, Wen-Tung
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1

Status and Performance of Integration Modules Toward Scaled..:

, In: 2023 International Electron Devices Meeting (IEDM),
Chou, Ang-Sheng ; Hsu, Ching-Hao ; Lin, Yu-Tung... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

ECDSA Certificate Enrollment and Authentication for SCEP Pr..:

, In: Advances in Intelligent Information Hiding and Multimedia Signal Processing; Smart Innovation, Systems and Technologies,
Hsu, Ding-Wen ; Chen, Hsuan-Tung ; Sun, Hung-Min. - p. 267-277 , 2023
Link: https://doi.org/10.1007/..
 
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3

Malignant Neoplasms of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Hu, Ming-Luen ; Chiu, Yi-Chun ; Tai, Wei-Chen... - p. 19-45 , 2023
Link: https://doi.org/10.1007/..
 
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4

High-Performance Monolayer WSe2 p/n FETs via Antimony-Plati..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chou, Ang-Sheng ; Lin, Yu-Tung ; Lin, Yuxuan Cosmi... - p. 7.2.1-7.2.4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge Fin..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chung, Hao-Tung ; Shih, Bo-Jheng ; Yang, Chih-Chao... - p. 34.5.1-34.5.4 , 2021
Link: https://doi.org/10.1109/..
 
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6

A mobile support system to assist DUI offenders on probatio..:

, In: Proceedings of the 2017 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2017 ACM International Symposium on Wearable Computers,
Hsu, Pei-Yi ; Lin, Ya-Fang ; Huang, Jian-Lun... - p. 77-80 , 2017
Link: https://dl.acm.org/doi/1..
 
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7

A 3.125 Gbps CMOS fully integrated optical receiver with ad..:

, In: 2007 IEEE Asian Solid-State Circuits Conference,
Chen, Wei-Zen ; Huang, Shih-Hao ; Wu, Guo-Wei... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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8

High-Endurance MoS2 FeFET with Operating Voltage Fess Than ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Lee, Tsung-En ; Chiang, Hung-Li ; Chang, Chih-Yu... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Monolayer-MoS2 Stacked Nanosheet Channel with C-type Metal ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Chung, Yun-Yan ; Yun, Wei-Sheng ; Chou, Bo-Jhih... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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10

Coarse-to-Fine Point Cloud Registration with SE(3)-Equivari..:

, In: 2023 IEEE International Conference on Robotics and Automation (ICRA),
Lin, Cheng-Wei ; Chen, Tung-I ; Lee, Hsin-Ying.. - p. 2833-2840 , 2023
Link: https://doi.org/10.1109/..
 
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11

Flexible chip placement via reinforcement learning : lat..:

, In: Proceedings of the 59th ACM/IEEE Design Automation Conference,
Chang, Fu-Chieh ; Tseng, Yu-Wei ; Yu, Ya-Wen... - p. 1392-1393 , 2022
Link: https://dl.acm.org/doi/1..
 
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12

A high-quality mixed-size analytical placer considering pre..:

, In: Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design,
Chen, Tung-Chieh ; Jiang, Zhe-Wei ; Hsu, Tien-Chang.. - p. 187-192 , 2006
Link: https://dl.acm.org/doi/1..
 
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13

NTUplace : a ratio partitioning based placement algorith..:

, In: Proceedings of the 2005 international symposium on Physical design,
Chen, Tung-Chieh ; Hsu, Tien-Chang ; Jiang, Zhe-Wei. - p. 236-238 , 2005
Link: https://dl.acm.org/doi/1..
 
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14

Development of LSTM and TCN Spindle Thermal Compensation Mo..:

, In: 2023 Sixth International Symposium on Computer, Consumer and Control (IS3C),
Tung-Hsien, Hsieh ; Wen-Yuh, Jywe ; Hsin-Yu, Lai.. - p. 5-8 , 2023
Link: https://doi.org/10.1109/..
 
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15

Scalable GaN-Based 64-Element Circularly-Polarized Transcei..:

, In: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024,
Tsao, Yi-Fan ; Desai, Arpan ; Hsu, Heng-Tung - p. 690-693 , 2024
Link: https://doi.org/10.1109/..
 
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