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Lee, Kuan-Hsin
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1

Optimizing back-and-forth live migration:

, In: Proceedings of the 9th International Conference on Utility and Cloud Computing,
Lee, Kuan-Hsin ; Lai, I-Cheng ; Lee, Che-Rung - p. 49-54 , 2016
Link: https://dl.acm.org/doi/1..
 
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2

Modeling Gamer Quality-of-Experience Using a Real Cloud VR ..:

, In: Proceedings of the 15th International Workshop on Immersive Mixed and Virtual Environment Systems,
Lee, Kuan-Yu ; Fang, Jia-Wei ; Sun, Yuan-Chun. - p. 12-17 , 2023
Link: https://dl.acm.org/doi/1..
 
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3

Will Dynamic Foveation Boost Cloud VR Gaming Experience?:

, In: Proceedings of the 33rd Workshop on Network and Operating System Support for Digital Audio and Video,
Fang, Jia-Wei ; Lee, Kuan-Yu ; Kämäräinen, Teemu.. - p. 29-35 , 2023
Link: https://dl.acm.org/doi/1..
 
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4

Optimal Camera Placement for 6 Degree-of-Freedom Immersive ..:

, In: Proceedings of the 1st Workshop on Interactive eXtended Reality,
Tang, Sheng-Ming ; Sun, Yuan-Chun ; Fang, Jia-Wei... - p. 31-39 , 2022
Link: https://dl.acm.org/doi/1..
 
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5

Toward Automatic Generation of Transcript From Spoken Lectu..:

, In: 2022 25th Conference of the Oriental COCOSDA International Committee for the Co-ordination and Standardisation of Speech Databases and Assessment Techniques (O-COCOSDA),
Lin, Tzu-Han ; Lee, Kuan-Lin ; Chung, Hsin-Yun... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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6

Statistical Analysis of Bit-Errors Distribution for Reliabi..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Wang, Nian-Jia ; Lee, Kuan-Yi ; Lin, Hsin-Yi... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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7

Characteristic Analysis of a Multi-chip Embedded Interposer..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Ching Kuan ; Liu, Wen-Hung ; Chang, Shu-Yi... - p. 55-56 , 2022
Link: https://doi.org/10.23919..
 
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8

Performance Improvement of DE Algorithm for Indoor Position..:

, In: Advanced Information Networking and Applications; Lecture Notes on Data Engineering and Communications Technologies,
Lee, Shu-Hung ; Cheng, Chia-Hsin ; Lu, Kuan-Hsien.. - p. 216-226 , 2024
Link: https://doi.org/10.1007/..
 
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9

U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Effici..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shih, Ching ; Hong, Ming-Chun ; Wang, Chih-Yao... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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10

Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Lee, Ou-Hsiang... - p. 2131-2135 , 2024
Link: https://doi.org/10.1109/..
 
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11

Design of High-RA STT-MRAM for Future Energy-Efficient In-M..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hong, Ming-Chun ; Su, Yi-Hui ; Chen, Guan-Long... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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12

A K-NN based Area Positioning System in Wireless Sensor Net..:

, In: 2023 12th International Conference on Awareness Science and Technology (iCAST),
Lee, Shu-Hung ; Cheng, Chia-Hsin ; Lu, Kuan-Hsien.. - p. 46-49 , 2023
Link: https://doi.org/10.1109/..
 
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13

Structure and Performance Co-optimization for the Developme..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Rahaman, Sk Ziaur ; Hsin, Yu-Chen ; Yang, Shan-Yi... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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14

U-MRAM: Transistor-Less, High-Speed (10 ns), Low-Voltage (0..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wu, Ming-Hung ; Hong, Ming-Chun ; Shih, Ching... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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15

$$\mathrm {D^2ADA}$$: Dynamic Density-Aware Active Domain A..:

, In: Lecture Notes in Computer Science; Computer Vision – ECCV 2022,
Wu, Tsung-Han ; Liou, Yi-Syuan ; Yuan, Shao-Ji... - p. 449-467 , 2022
Link: https://doi.org/10.1007/..
 
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