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Lo, C.
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1

Stability Study of Quantum Dot Color Converted Mini/Micro-L..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Cheng, Yuanjie ; Lo, Jeffery C.C. ; Qiu, Xing... - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
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2

Assembly of Printed Interconnects for Immobilized Protein M..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Xu, Qianwen ; Lee, S. W. Ricky ; Guo, Yusong. - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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3

Quantum Dot Color Conversion Film with Enhanced Color Rende..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing... - p. 135-136 , 2023
Link: https://doi.org/10.23919..
 
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4

Development and initial evaluation of 3D-printed ultra-high..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Toyonaga, T. ; Shanina, E. ; Lo, C.... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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5

Intel PowerVia Technology: Backside Power Delivery for High..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hafez, W. ; Agnihotri, P. ; Asoro, M.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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6

Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Xu, Hua ; Lo, Jeffery C.C. ; Qiu, Xing... - p. 21-24 , 2023
Link: https://doi.org/10.1109/..
 
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7

Solderability Analysis of Inkjet-printed Silver Pads with S..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Jiang, Qian ; Tu, Ning ; Lo, Jeffery C. C.. - p. 65-66 , 2022
Link: https://doi.org/10.23919..
 
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8

A UVC LED Disinfection Closet for Reuse of Protective Coats:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Qiu, Xing ; Lo, Jeffery C. C. ; Cheng, Yuanjie... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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9

Improved Inkjet Printing of Polydimethylsiloxane Droplets:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Tu, Ning ; Lo, Jeffery C.C. ; Lee, S.W. Ricky - p. 241-242 , 2022
Link: https://doi.org/10.23919..
 
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10

Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pad..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Lo, Jeffery C. C. ; Jiang, Qian ; Qiu, Xing.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Inkjet Printing High Resolution Polydimethylsiloxane Dots A..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Tu, Ning ; Lo, Jeffery C. C. ; Ricky Lee, S. W. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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12

Evaluation and Reduction of Optical Crosstalk in Quantum Do..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing. - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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13

Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED ..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing. - p. 153-154 , 2021
Link: https://doi.org/10.23919..
 
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14

Quantum Dot Film Patterning on a Trenched Glass Substrate f..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Cheng, Yuanjie ; Lo, Jeffery C. C. ; Qiu, Xing.. - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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15

Cross-sectioning Technique for Bonded Silicon Substrates wi..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Xu, Hua ; Lo, Jeffery C.C. ; Lee, S.W. Ricky - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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