I agree that this site is using cookies. You can find further informations here.
X
Wu, Po-kuan
290  results:
Bookchapter (Online) X
Search for persons X
?
1

A Needs Analysis for Education and Learning in Young Child ..:

, In: Proceedings of the 3rd International Conference on Education and Multimedia Technology,
Wu, Chun-Kuan ; Lee, Yann-Long ; Lin, Meng-Hsiu.. - p. 89-93 , 2019
Link: https://dl.acm.org/doi/1..
 
?
2

53.5625 Gb/s X 4-ch Optical Interconnect Module Based on Si..:

, In: 2019 IEEE CPMT Symposium Japan (ICSJ),
Chen, Chin-Ta ; Lan, Hsiao-Chin ; Shen, Po-Kuan... - p. 209-211 , 2019
Link: https://doi.org/10.1109/..
 
?
3

Chip-level 10-Gbit/s optical interconnects using 1 × 2 poly..:

, In: OFC 2014,
Chen, Chin-Ta ; Shen, Po-Kuan ; Teng-Zhang Zhu... - p. 1-3 , 2014
Link: https://doi.org/10.1364/..
 
?
4

One Shot Learning for Speech Separation:

, In: ICASSP 2021 - 2021 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Wu, Yuan-Kuei ; Huang, Kuan-Po ; Tsao, Yu. - p. 5769-5773 , 2021
Link: https://doi.org/10.1109/..
 
?
5

On-chip optical interconnects integrated with laser and pho..:

, In: OFC 2014,
Po-Kuan Shen ; Chin-Ta Chen ; Chia-Hao Chang... - p. 1-3 , 2014
Link: https://doi.org/10.1364/..
 
?
6

A Refractive Distortion Correction Method for 3D Root Recon..:

, In: 2023 Sixth International Symposium on Computer, Consumer and Control (IS3C),
Li, Mu-Wei ; Wu, Po-Lung ; Lo, Shuen-Fang.. - p. 114-117 , 2023
Link: https://doi.org/10.1109/..
 
?
7

A Self-powering Wireless Soil-pH and Electrical Conductance..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Wu, Chuan-Yi ; Liu, Chi-Wei ; Chen, Jing-Siang... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
?
8

Investigation on selectively etched SiGe and Si surface for..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chang, Wei-Yuan ; Chu, Chun-Lin ; Luo, Guang-Li... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
?
9

Research on Optimization of Dielectric Layer Thickness Stan..:

, In: 2022 25th International Conference on Mechatronics Technology (ICMT),
Wu, Cheng-Wei ; Liu, Tung-Kuan ; Hsueh, Po-Wen - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
?
10

Improved Trigger Time of Force Sensorless Power-Assisted Sy..:

, In: 2022 25th International Conference on Mechatronics Technology (ICMT),
Hsueh, Po-Wen ; Kao, Tien-Min ; Wu, Jian-Hua. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
?
11

Process and Structure Considerations for the Post FinFET Er:

, In: 2020 IEEE Silicon Nanoelectronics Workshop (SNW),
Su, Chun-Jung ; Sung, Po-Jung ; Kao, Kuo-Hsing... - p. 13-14 , 2020
Link: https://doi.org/10.1109/..
 
?
12

Ultrahigh responsivity and tunable photogain BEOL compatibl..:

, In: 2020 IEEE Symposium on VLSI Technology,
Yang, Chih-Chao ; Hsieh, Ping-Yi ; Chen, Po-Han... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
?
13

A numerical study of Si-TMD contact with n/p type operation..:

, In: 2016 IEEE International Electron Devices Meeting (IEDM),
Tang, Ying-Tsan ; Li, Kai-Shin ; Li, Lain-Jong... - p. 14.3.1-14.3.4 , 2016
Link: https://doi.org/10.1109/..
 
?
14

Temperature coefficient of resistance related to amorphous ..:

, In: 2016 3rd International Conference on Devices, Circuits and Systems (ICDCS),
Su, Jyun-Hao ; Yeh, Wen-Kuan ; Chang, Wen-Teng... - p. 63-67 , 2016
Link: https://doi.org/10.1109/..
 
?
15

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Zhang, Jie ; Lu, Wei ; Huang, Po-Tsang... - p. 262-263 , 2022
Link: https://doi.org/10.1109/..
 
1-15