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2022 International Conference on Cyber-Physical Social Intelligence (ICCSI) ,
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Debonding Detection in Carbon Fiber Reinforced Polymer Plat..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Solder Joint Reliability Assessment on FO-CSP for Next Gene..:
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2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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Common Source Line-to-Word Line Short Improvement by Elimin..:
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2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio..:
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2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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Improvement of Twisting and Line-Edge Roughness of 3D NAND ..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Thermal Design of SiC Power Module for EV/HEV Applications:
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2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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Machine learning Assists on High Aspect Ratio Slit Trench E..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2019 ,
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Application of New Downhole Oil-Water Separation in the Sam..:
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Sustainability in Energy and Buildings; Smart Innovation, Systems and Technologies ,
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Solar Home System with Peak-Shaving Function and Smart Cont..:
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Proceedings of the 2018 on Great Lakes Symposium on VLSI ,
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A Hybrid Approach to Equivalent Fault Identification for Ve..:
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2022 IEEE International Conference on Consumer Electronics - Taiwan ,
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Image Blending Methods for Defective PCB Image Generation:
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2020 17th International Computer Conference on Wavelet Active Media Technology and Information Processing (ICCWAMTIP) ,
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Classification of Surface Natural Resources based On U-NET ..:
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2007 IEEE International Symposium on Circuits and Systems (ISCAS) ,
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Low-Latency Quasi-Synchronous Transmission Technique for Mu..:
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Proceedings of the CHI Conference on Human Factors in Computing Systems ,
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