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Lee, Hsing-Feng
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1

Analyzing Gate-Driven Circuit Parameters for Adding ESD Per..:

, In: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW),
Huang, Shao-Chang ; Liao, Chih-Cherng ; Liao, Hsien-Feng... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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2

Investigating Factors Influencing the Retention Intention o..:

, In: 2023 12th International Conference on Awareness Science and Technology (iCAST),
Lee, Chin-Feng ; Kang, Tz-Ruei ; Hou, Hsing-Yu - p. 321-325 , 2023
Link: https://doi.org/10.1109/..
 
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3

E-learning Behavior Analytics in the Curriculum of Big Data..:

, In: 2021 International Conference on Security and Information Technologies with AI, Internet Computing and Big-data Applications; Smart Innovation, Systems and Technologies,
Hou, Hsing-Yu ; Lee, Chin-Feng ; Chen, Chih-Teng. - p. 169-179 , 2022
Link: https://doi.org/10.1007/..
 
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4

Applying Talent Quality-Management System (TTQS) and Inform..:

, In: Advances in Intelligent Systems and Computing; Security with Intelligent Computing and Big-Data Services 2019,
Hou, Hsing-Yu ; Agrawal, Somya ; Lo, Yu-Lung. - p. 207-217 , 2020
Link: https://doi.org/10.1007/..
 
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5

Research on Screening Replacement and Energy Harvesting Tec..:

, In: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII),
Tzeng, Ching-Biau ; Lee, Hsing-Jen ; Su, Bing-Hong.. - p. 741-746 , 2023
Link: https://doi.org/10.1109/..
 
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6

Noise Analysis and Improvement of Power Supply Network Base..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Su, Bing-Hong ; Tang, Jie-Song ; Lee, Hsing-Jen. - p. 317-320 , 2023
Link: https://doi.org/10.1109/..
 
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7

Evaluation of the Impact of Low Parasitic Losses on Power C..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Cai, Ming-Xian ; Lee, Hsing-Jen ; Tzeng, Ching-Biau - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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8

A Glimpse of Pedagogical Impacts of Social Media: Mirror, M..:

, In: Expanding Global Horizons Through Technology Enhanced Language Learning; Lecture Notes in Educational Technology,
Lee, Hsing-Chin - p. 19-35 , 2021
Link: https://doi.org/10.1007/..
 
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9

Automated double oral auction using I.B.M PC network (abstr..:

, In: Proceedings of the 1986 ACM fourteenth annual conference on Computer science,
Johnson, Alonzo ; Lee, Hsing-Yang ; Dryer, John - p. 507 ff. , 1986
Link: https://dl.acm.org/doi/1..
 
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10

RESURF Region Variation Induced Current Crowding Effect on ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Lee, Jian-Hsing ; Li, Ching-Ho ; Nidhi, Karuna... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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11

A Combination of Implant Shadow and Skin Effects Leading to..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Lee, Jian-Hsing ; Li, Ching-Ho ; Liao, Chih-Cherng... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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12

Trainable Multi-Rate PCEN Frontend for Bird Sound Detection:

, In: 2023 International Automatic Control Conference (CACS),
Perkins, Spencer ; Lee, Chang-Hsing ; Lien, Cheng Chang - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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13

Transmission Line Pulse Width Impacting on Device Performan..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Huang, Shao-Chang ; Wang, Chien-Wei ; Lin, Chih-Hsuan... - p. 227-228 , 2023
Link: https://doi.org/10.1109/..
 
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14

A Concise Electrothermal Model to Characterize the Thermal ..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Lee, Jian-Hsing ; Lin, Gong-Kai ; Chen, Chun-Chih... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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15

Optimizing Device Metal Routing Layouts by the Simulation T..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Huang, Shao-Chang ; Li, Ching-Ho ; Liao, Chih-Cherng... - p. 219-220 , 2023
Link: https://doi.org/10.1109/..
 
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