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Zhang, JJ.H.
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1

Fan-Out RDL-first Panel-Level Packaging for Heterogeneous I..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Yang, Kai-Ming... - p. 339-347 , 2020
Link: https://doi.org/10.1109/..
 
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2

ELEPHANT TRANSLOCATION:

, In: Elephant management,
Grobler, Douw G ; van Altena, JJ ; Malan, Johan H. - p. 241-256 , 2008
Link: https://doi.org/10.18772..
 
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3

Distributed meetings : a meeting capture and broadcastin..:

, In: Proceedings of the tenth ACM international conference on Multimedia,
Cutler, Ross ; Rui, Yong ; Gupta, Anoop... - p. 503-512 , 2002
Link: https://dl.acm.org/doi/1..
 
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4

A probe system for microwave characterization of transistor..:

, In: 1967 IEEE International Solid-State Circuits Conference. Digest of Technical Papers,
Pan, J-J. ; Cooke, H. - p. 104,105 , 1967
Link: https://doi.org/10.1109/..
 
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