Fang, Wei-Jia
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2

A Randomized, Open-Label, Multicenter, Phase 3 Study of Hig..:

Wang, Feng ; He, Ming-Ming ; Xiao, Jian...
Clinical Cancer Research.  28 (2022)  19 - p. 4232-4239 , 2022
 
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A DNA minor groove binder shows high effectiveness as a que..:

Fang, Wei-Jia ; Jin, Da-Zhi ; Luo, Yun...
Bioorganic & Medicinal Chemistry Letters.  24 (2014)  16 - p. 3956-3960 , 2014
 
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Modeling Gamer Quality-of-Experience Using a Real Cloud VR ..:

, In: Proceedings of the 15th International Workshop on Immersive Mixed and Virtual Environment Systems,
Lee, Kuan-Yu ; Fang, Jia-Wei ; Sun, Yuan-Chun. - p. 12-17 , 2023
 
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Preparation of a novel hollow porous LiMn2O4 film electrode..:

Wang, Jing ; Fang, Jia-Wei ; Ji, Zhi-Yong...
Journal of Environmental Chemical Engineering.  11 (2023)  5 - p. 110878 , 2023
 
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Neuron-Derived Exosomes Promote the Recovery of Spinal Cord..:

Xu, Yi ; Zhu, Zheng-huan ; Xu, Xu...
Molecular Neurobiology.  60 (2023)  8 - p. 4502-4516 , 2023
 
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Numerical investigation on Rayleigh-Bénard convection of cy..:

Fang, Jia-Wei ; Zhang, Li ; Mo, Dong-Ming.
International Journal of Thermal Sciences.  183 (2023)  - p. 107820 , 2023
 
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Will Dynamic Foveation Boost Cloud VR Gaming Experience?:

, In: Proceedings of the 33rd Workshop on Network and Operating System Support for Digital Audio and Video,
 
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Establishment of PPy-derived carbon encapsulated LiMn2O4 fi..:

Fang, Jia-Wei ; Wang, Jing ; Ji, Zhi-Yong...
Separation and Purification Technology.  280 (2022)  - p. 119726 , 2022
 
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Enhancing situational awareness with adaptive firefighting ..:

, In: Proceedings of the 13th ACM Multimedia Systems Conference,
Fan, Tzu-Yi ; Liu, Fangqi ; Fang, Jia-Wei.. - p. 279-286 , 2022
 
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Flip-chip routing with unified area-I/O pad assignments for..:

, In: Proceedings of the 46th Annual Design Automation Conference,
 
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Routing for chip-package-board co-design considering differ..:

, In: Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design,
Fang, Jia-Wei ; Ho, Kuan-Hsien ; Chang, Yao-Wen - p. 512-517 , 2008
 
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Area-I/O flip-chip routing for chip-package co-design:

, In: Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design,
Fang, Jia-Wei ; Chang, Yao-Wen - p. 518-522 , 2008
 
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