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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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A novel and simple method of low temperature, low process t..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Low-Temperature and Pressureless Cu-to-Cu Bonding by Electr..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Mic..:
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2007 IEEE Conference on Electron Devices and Solid-State Circuits ,
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