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2024 IEEE International Reliability Physics Symposium (IRPS) ,
1
Single-Event Performance of Flip Flop Designs at the 5-nm B..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
2
Total-Ionizing Dose Damage from X-Ray PCB Inspection System:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
3
Effects of Collected Charge and Drain Area on SE Response o..:
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2022 IEEE International Reliability Physics Symposium (IRPS) ,
6
Single-Event Latchup Vulnerability at the 7-nm FinFET Node:
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2022 IEEE International Reliability Physics Symposium (IRPS) ,
7
Soft Error Characterization of D-FFs at the 5-nm Bulk FinFE..:
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2021 21th European Conference on Radiation and Its Effects on Components and Systems (RADECS) ,
8
Micro-Latchup Location and Temperature Characterization in ..:
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Schritte in die künftige Mobilität / Heike Proff; Werner Pascha; Jörg Schönharting; Dieter Schramm (Hrsg.)
10
Relevanz der Intermodalität für CarSharing-Konzepte:
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Zentrale:E02 a ver 367/702
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Juristische Arbeitsblätter
15
Locke, Lindau, Luxenburg ; Zur Behandlung der auswärtigen ..:
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BB Nat.-NW1: z jur 001/681; Juridicum: z jur 001/681