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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
4
Analysis of vacancies in wafer-bonding interface via positr..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6
Elucidating the mechanism of four corner voids in chip-on-w..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
11
Method to evaluate the adhesion distribution on wafers:
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2023 International Conference on Computer Graphics and Image Processing (CGIP) ,
14
Determining region color by using maximum colorfulness:
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2023 Nicograph International (NicoInt) ,
15