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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Cu/Dielectric hybrid bonding among Glass and Si:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
4
Defect evolution during through-silicon via copper electrop..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6