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Wang, Fengjiang
277
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Online (277)
Mediatypes
Articles (Online) (192)
Bookchapter (Online) (3)
OpenAccess-fulltext (82)
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?
1
Structural, mechanical and thermodynamic properties of Mg24..:
Liao, Mingqing
;
Wu, Yuesheng
;
Zhou, Fei
...
Vacuum. 228 (2024) - p. 113511 , 2024
Link:
https://doi.org/10.1016/..
?
2
Effect of minor Sb addition on microstructure, interfacial ..:
Wang, Fengjiang
;
Lv, Pengcheng
;
Zhang, Jiayu
Journal of Materials Science: Materials in Electronics. 35 (2024) 18 - p. , 2024
Link:
https://doi.org/10.1007/..
?
3
CHEABC-QCRP: A novel QoS-aware cluster routing protocol for..:
Wang, Fengjiang
;
Rao, Chuchu
;
Fang, Xiaosheng
.
Simulation Modelling Practice and Theory. 134 (2024) - p. 102951 , 2024
Link:
https://doi.org/10.1016/..
?
4
Interfacial structure and strength of Al‐25Si‐4Mg‐1Cu joint..:
Ma, Qiang
;
Chen, Yongwei
;
Li, Shengguo
...
Engineering Reports. 5 (2023) 8 - p. , 2023
Link:
https://doi.org/10.1002/..
?
5
Elastic and thermodynamic properties of B2-MgX intermetalli..:
Liao, Mingqing
;
Zhou, Fei
;
Wang, Fengjiang
..
Vacuum. 218 (2023) - p. 112646 , 2023
Link:
https://doi.org/10.1016/..
?
6
A New Adaptive Elite Evolutionary Algorithm for Task Alloca..:
, In:
2023 IEEE 11th International Conference on Information, Communication and Networks (ICICN)
,
Wang, Mengfei
;
Fei, Hongmei
;
Jia, Dingyi
... - p. 57-62 , 2023
Link:
https://doi.org/10.1109/..
?
7
In or Ni addition on mechanical properties and interfacial ..:
Chen, Jiawei
;
Liao, Mingqing
;
Wang, Fengjiang
Journal of Materials Science: Materials in Electronics. 34 (2023) 20 - p. , 2023
Link:
https://doi.org/10.1007/..
?
8
CALPHAD aided mechanical properties screening in full compo..:
Liao, Mingqing
;
Gong, Hongshun
;
Qu, Nan
...
International Journal of Refractory Metals and Hard Materials. 113 (2023) - p. 106191 , 2023
Link:
https://doi.org/10.1016/..
?
9
Effect of trace Ge on interfacial reaction and shear streng..:
Yang, Weiran
;
Ding, Yu
;
Liao, Mingqing
.
Journal of Materials Science: Materials in Electronics. 33 (2022) 21 - p. 17137-17151 , 2022
Link:
https://doi.org/10.1007/..
?
10
Thermomigration behavior of Sn–Bi joints under different su..:
Wu, Jun
;
Wang, Kaipeng
;
Wang, Fengjiang
.
Journal of Materials Science: Materials in Electronics. 33 (2022) 10 - p. 8127-8139 , 2022
Link:
https://doi.org/10.1007/..
?
11
Unexpected low thermal expansion coefficients of pentadiamo..:
Liao, Mingqing
;
Wang, Yi
;
Wang, Fengjiang
..
Physical Chemistry Chemical Physics. 24 (2022) 38 - p. 23561-23569 , 2022
Link:
https://doi.org/10.1039/..
?
12
Development of lead-free interconnection materials in elect..:
Zhong, Su-juan
;
Zhang, Liang
;
Li, Mu-lan
..
Materials & Design. 215 (2022) - p. 110439 , 2022
Link:
https://doi.org/10.1016/..
?
13
P212121-C16: An ultrawide bandgap and ultrahard carbon allo..:
Liao, Mingqing
;
Maimaitimusha, Jumahan
;
Zhang, Xueting
..
Frontiers of Physics. 17 (2022) 6 - p. , 2022
Link:
https://doi.org/10.1007/..
?
14
P2221-C8: A novel carbon allotrope denser than diamond:
Liao, Mingqing
;
Wang, Fengjiang
;
Zhu, Jingchuan
..
Scripta Materialia. 212 (2022) - p. 114549 , 2022
Link:
https://doi.org/10.1016/..
?
15
Ultrasonic welding of fiber reinforced thermoplastic compos..:
Wang, Yaqiong
;
Rao, Zhenghua
;
Liao, Shengming
.
Composites Part A: Applied Science and Manufacturing. 149 (2021) - p. 106578 , 2021
Link:
https://doi.org/10.1016/..
1-15