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Wang, Xuefan
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1

Ag2[TeO2(OH)4]: A Nonlinear Optical Tellurate with Balanced..:

Tan, Wenjing ; Wang, Xuefan ; Wei, Ruqing...
Journal of Materials Chemistry C.  , 2024
Link: https://doi.org/10.1039/..
 
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2

Oriented design of wafer-level stacking structures to enhan..:

Wang, Fangcheng ; Liu, Qiang ; Li, Jinhui...
Optics & Laser Technology.  169 (2024)  - p. 110169 , 2024
Link: https://doi.org/10.1016/..
 
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3

Conjugated microporous polyimide cathodes for sodium/lithiu..:

Chen, Lei ; Li, Yuke ; Wang, Xuefan...
Chemical Engineering Journal.  464 (2023)  - p. 142658 , 2023
Link: https://doi.org/10.1016/..
 
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4

In situ strength profiles along two adjacent vertical drill..:

Wang, Xuefan ; Peng, Peng ; Shan, Zhigang.
Journal of Rock Mechanics and Geotechnical Engineering.  15 (2023)  1 - p. 146-168 , 2023
Link: https://doi.org/10.1016/..
 
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5

Development of Thermal Resistant Temporary Bonding Material..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Kang ; Bai, Yun ; Liu, Qiang... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Interpretation Method for Lost Gas in Deep Coalbed and Its ..:

Deng, Ze ; Wang, Hongyan ; Jiang, Zhenxue...
Processes.  11 (2023)  1 - p. 200 , 2023
Link: https://doi.org/10.3390/..
 
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7

A Single-layer Photosensitive Polymer Material for Temporar..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Xuefan ; Liu, Qiang ; Wang, Fangcheng... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

A UV-curing Temporary Bonding Material with High-temperatur..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Yanting ; Bai, Yun ; Zeng, Yalin... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Ablation Behaviour of Photosensitive Materials in Laser Deb..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Fangcheng ; Liu, Qiang ; Wang, Xuefan... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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10

A Novel Process to Reduce the Warpage of Bond Pair for Temp..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Bai, Yun ; Li, Kang ; Huang, Shan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Addressing Random Variations in MWD Penetration Rate with t..:

Wu, Siyuan ; Wang, Xuefan ; Yue, Zhongqi Quentin
Sustainability.  14 (2022)  20 - p. 13456 , 2022
Link: https://doi.org/10.3390/..
 
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12

Temporary bonding system with photopolymer release layer fo..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Xuefan ; Liu, Qiang ; Wang, Fangcheng... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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13

Impact of different dietary regimens on the lipidomic profi..:

Deng, Liang ; Yang, Yixin ; Li, Zheng...
Food Research International.  156 (2022)  - p. 111305 , 2022
Link: https://doi.org/10.1016/..
 
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14

A Novel Single-Layer High-Temperature-Resistant Adhesive La..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Dai, Wenxue ; Liu, Qiang ; Li, Zhipeng... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

Nondestructive Laser Debonding of Designable Responsive and..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Fangcheng ; Liu, Qiang ; Wang, Xuefan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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