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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Sensitivity Study of Wafer-Level Packaging Lifetime Predict..:
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
2
AI-assisted Design for Reliability: Review and Perspectives:
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
3
Study on the feasible mesh size control method for WLP 3D f..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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A robust mesh size control technology suitable for various ..:
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2024 International Conference on Electronics Packaging (ICEP) ,
5
The Strategy on Artificial Neural Networks for Predicting A..:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Use Artificial Neural Network to fit stress-strain curve of..:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
7
Development of a Semi-Automatic Probe Card Adjustment Equip..:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
12
Fitting Solder305 Anand Model Parameters with Artificial Ne..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
13