Chung, C
725  Ergebnisse:
Personensuche X
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1

Preparation of Metal Salt-Doped Silicon/Silicon Titanium Na..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yu, C. S. ; Zhu, Y.J. ; Chung, C. L. - p. 317-318 , 2024
 
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2

Effect of the Ratio of Na, K and Li on the PL Performance, ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, J. Y. ; Chung, C. L. ; Lin, J. D. - p. 315-316 , 2024
 
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3

Characterization of Chitin or Chitosan/PEO Nanofibers Prepa..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wu, K. H. ; Wu, C. Y. ; Chung, C. L. - p. 319-320 , 2024
 
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4

Fabrication of Various Types of Si-Ti Fibers or Films by El..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Yi. Min ; Yu, Chang. Shiue. ; Chung, C. L. - p. 243-244 , 2023
 
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5

Effects of Temperature and Humidity on The Surface and Mech..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Tsai, C. Y. ; Wu, K. H. ; Chung, C. L. - p. 245-246 , 2023
 
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6

The Effect of TEOS Ratio and Calcination Temperature on Pho..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chao, Y. C. ; Shih, J. Y. ; Chung, C. L. - p. 241-242 , 2023
 
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7

The Effect of Humidity on the Morphological Evolution of β-..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Tsai, C. Y. ; Chung, C. L. - p. 179-180 , 2022
 
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8

Preparation of Ti/Si-Ti Base Nanofibers by Electrospinning ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lin, Y. M. ; Chao, Y. C. ; Chung, C. L. - p. 183-184 , 2022
 
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10

Contributors:

, In: Modifying Food Texture,
Chen, J. ; Chen, L. ; Chung, C.... - p. ix-x , 2015
 
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11

Magnetic Resonance Imaging of the Elbow:

, In: Musculoskeletal Diseases,
Chung, C. ; Steinbach, L. - p. 7-12 , 2005
 
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12

Neutron flux measurements in radiation damage experiments o..:

, In: Recent Advances in Multidisciplinary Applied Physics,
LEE, H ; KIM, D ; CHUNG, C... - p. 853-858 , 2005
 
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13

3D simulation of cross field devices:

, In: ICOPS 2000. IEEE Conference Record - Abstracts. 27th IEEE International Conference on Plasma Science (Cat. No.00CH37087),
Ludeking, L.D. ; Smithe, D.N. ; Smith, R.. - p. 96 , 2000
 
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14

A reliable datagram protocol on local area networks:

, In: Proceedings of the ACM SIGCOMM conference on Communications architectures & protocols,
Lee, D ; Chon, K ; Chung, C - p. 320-327 , 1986
 
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15

Impact of Plug-in Electric Vehicle Charging and Roof-top PV..:

, In: 2023 IEEE Canadian Conference on Electrical and Computer Engineering (CCECE),
 
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