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Conti, Fosca
4  Ergebnisse:
Buchkapitel (Online) X
englisch X
Personensuche X
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1

Finite Element simulations and Raman measurements to invest..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Conti, Fosca ; Liu, E ; Bhogaraju, Sri Krishna.. - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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2

Copper die bonding using copper formate based pastes with α..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Bhogaraju, Sri Krishna ; Conti, Fosca ; Elger, Gordon - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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3

Investigation of Thermomechanical Local Stress Induced in A..:

, In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Brugnolotto, Enrico ; Bhogaraju, Sri Krishna ; Liu, E... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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4

Hybrid Cu particle paste with surface-modified particles fo..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Bhogaraju, Sri Krishna ; Mokhtari, Omid ; Pascucci, Jacopo... - p. 1-8 , 2019
Link: https://doi.org/10.23919..
 
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