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X
Lin, Mei-Na
379  Ergebnisse:
Buchkapitel (Online) X
englisch X
Personensuche X
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1

Investigation on the Root Cause of ESD Failure of Large Siz..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Zhang, Yunhe ; Lin, Shaobing ; Chao, Shuanshe... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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2

Study on ELK Dielectric Reliability During the Solder Reflo..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Zheng, Jialin ; Zhao, Yunong ; Wang, Zhuqiu... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

Study on Failure Mechanism of C4 Bump Solder Excursion in C..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Wei, Xixiong ; Lin, Xinyi ; Zhou, Shilu.. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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4

Organic Thermal Interface Materials Delamination Analysis o..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Wu, Zhuolun ; Wei, Xixiong ; Wang, Zhuqiu... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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5

Research on the Functional Failure of Large Scale Chips Cau..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Chao, Shuanshe ; Lin, Xinyi ; Wei, Xixiong... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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6

A New High-efficient Burn-in Screening Methodology Applied ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Sheng, Yalan ; Gao, Yining ; Sun, Niuyi... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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7

Failure Analysis for IIH leakage on 7nm FinFFT Technology C..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Chao, Shuanshe ; Lin, Xinyi ; Dong, Chen... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Correlation Analysis between Warpage and Metal Thermal Inte..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Zhuolun ; Wang, Zhuqiu ; Qi, Di... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Study on Stress Migration of FCQFN Package with Unbalanced ..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Chao, Shuanshe ; Lin, Xinyi ; Yang, Dan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

Fault Localization of Functional Failure by using Dynamic E..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Ouyang, Keqing ; Wei, Xixiong ; Lin, Xinyi... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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11

Measurement Process Optimization in Using Lock-in Thermogra..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Chao, Shuanshe ; Mei, Na ; Lin, Xinyi... - p. 1-4 , 2021
Link: https://doi.org/10.1109/..
 
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12

List of contributors:

, In: Privileged Scaffolds in Drug Discovery,
Alam, Mohammad Abrar ; Cao, Jin-Xu ; Cao, Peng... - p. xvii-xxii , 2023
Link: https://doi.org/10.1016/..
 
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13

List of Contributors:

, In: Recent Advances in Cancer Research and Therapy,
Cai, Ying ; Cao, Xin ; Chao, Chi-Hong... - p. xix-xxvi , 2012
Link: https://doi.org/10.1016/..
 
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14

Novel Annotation and Metrics for Mangrove Species Classific..:

, In: 2023 IEEE International Conference on Image Processing (ICIP),
Lim, Han Shen ; Lee, Yunli ; Eu, Kok Seng... - p. 2030-2034 , 2023
Link: https://doi.org/10.1109/..
 
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15

A Cyber-Physical Mixed Reality System to Facilitate Chemica..:

, In: 2023 14th IIAI International Congress on Advanced Applied Informatics (IIAI-AAI),
Lin, Mei-Feng ; Li, Ming-Chaun ; Chen, Chih-Ming. - p. 168-173 , 2023
Link: https://doi.org/10.1109/..
 
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