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2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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Investigation of defective bonding pad affected by the cont..:
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Proceedings of the 2017 International Conference on Industrial Design Engineering ,
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Classification Performance Analysis Regarding Margin of Ene..:
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Proceedings of the eleventh international conference on Information and knowledge management ,
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Intelligent knowledge discovery in peer-to-peer file sharin:
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2004 IEEE Region 10 Conference TENCON 2004. ,
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Improvement of characteristics of active-clamped ZVS forwar..:
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2017 International Conference on Platform Technology and Service (PlatCon) ,
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ATHENA: Distributed IoT Systems Providing Salient Features ..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibra..:
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2020 International Conference on Information and Communication Technology Convergence (ICTC) ,
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Feature Selection for Stock forecasting using Multivariate ..:
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2019 International Conference on Information and Communication Technology Convergence (ICTC) ,
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Forecasting Daily Stock Trends Using Random Forest Optimiza..:
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ,
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Study of intermetallic compound growth and failure mechanis..:
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2023 IEEE Conference on Energy Conversion (CENCON) ,
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Analysis of Switching Loss Based on Gate Resistance in a Si..:
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2023 IEEE International Conference on Big Data and Smart Computing (BigComp) ,
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Transformer-Based Flood Detection Using Multiclass Segmenta..:
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2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia) ,
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Dual Magnetic Flux Frame Direct Self Control for Open-End W..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A 1-Tb, 4b/Cell, 176-Stacked-WL 3D-NAND Flash Memory with I..:
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2022 IEEE Energy Conversion Congress and Exposition (ECCE) ,
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