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Thi Huyen, Le
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1

Wideband Antennas on Thin-Film Packaging Substrates for 140..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Le, Thi Huyen ; Kaiser, Michael Philipp ; Koezegi, Julia-Marie... - p. 732-737 , 2024
Link: https://doi.org/10.1109/..
 
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2

Temperature dependent Dielectric Characterization of Low Lo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Murugesan, Kavin Senthil ; Schneider, Jens ; Le, Thi Huyen... - p. 865-870 , 2024
Link: https://doi.org/10.1109/..
 
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3

3D Freeform Antenna-in-Package Approach for FOWLP:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Thomas, Tina ; Becker, Karl-Friedrich... - p. 247-252 , 2023
Link: https://doi.org/10.1109/..
 
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4

Wideband THz Yagi-Uda Bond Wire Antennas:

, In: 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI),
Ndip, Ivan ; Le, Thi Huyen ; Schneider-Ramelow, Martin - p. 1909-1910 , 2023
Link: https://doi.org/10.1109/..
 
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5

3D Mold Embedded PCB-based MIMO Antenna Arrays for 79 GHz A..:

, In: 2023 20th European Radar Conference (EuRAD),
Le, Thi Huyen ; Kaiser, Michael ; Ndip, Ivan... - p. 2-5 , 2023
Link: https://doi.org/10.23919..
 
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6

Sub-TeraHertz Modular Array Layout Optimization Under Fabri..:

, In: 2022 Joint European Conference on Networks and Communications & 6G Summit (EuCNC/6G Summit),
Dehkordi, Saeid K. ; Schwanitz, Oliver ; Marandi, Mostafa Khalili... - p. 31-36 , 2022
Link: https://doi.org/10.1109/..
 
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7

Design, Fabrication and Measurement of FOWLP-based Series-F..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Le, Thi Huyen ; Schwanitz, Oliver ; Ndip, Ivan... - p. 593-596 , 2022
Link: https://doi.org/10.1109/..
 
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8

Wide Band Dual Polarized Antenna Array for 5G mmWave based ..:

, In: 2022 24th International Microwave and Radar Conference (MIKON),
Le, Thi Huyen ; Schwanitz, Oliver ; Ndip, Ivan... - p. 1-4 , 2022
Link: https://doi.org/10.23919..
 
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9

A Novel Packaging and System-Integration Platform with Inte..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Ndip, Ivan ; Andersson, Kristoffer ; Kosmider, Stefan... - p. 101-107 , 2020
Link: https://doi.org/10.1109/..
 
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10

Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging..:

, In: 2020 23rd International Microwave and Radar Conference (MIKON),
Le, Thi Huyen ; Kanitkar, Abhijeet ; Rossi, Marco... - p. 157-161 , 2020
Link: https://doi.org/10.23919..
 
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11

Green Consumption: The Case Study of Purchase Intention Tow..:

, In: Knowledge Transformation and Innovation in Global Society,
Thi, Huyen Pham ; Thai, Ha-Anh Pham ; Thi, Ha Nguyen.. - p. 353-366 , 2024
Link: https://doi.org/10.1007/..
 
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12

Ar*: a Bounded Suboptimal Search algorithm using Conditiona..:

, In: 2023 14th International Conference on Information and Communication Technology Convergence (ICTC),
Dam, Tien Minh ; Tran Le, Dao ; Truong, Long Viet... - p. 985-990 , 2023
Link: https://doi.org/10.1109/..
 
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13

Application Artificial Intelligence to Identifying and Pers..:

, In: 2023 1st International Conference on Health Science and Technology (ICHST),
Nguyen Thi, Trang ; Trinh Le, Huy ; Nguyen Viet, Nhung... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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14

PCB Embedding Technology for 5G mmWave Applications:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Kosmider, Stefan ; Loher, Thomas ; Ostmann, Andreas... - p. 603-609 , 2022
Link: https://doi.org/10.1109/..
 
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15

Repeated index modulation for OFDM with space and frequency..:

, In: 2017 International Conference on Advanced Technologies for Communications (ATC),
Le Thi Thanh, Huyen ; Nam Tran, Xuan - p. 97-102 , 2017
Link: https://doi.org/10.1109/..
 
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