Wang, Yun-Ping
1869  Ergebnisse:
Personensuche X
?
1

Analysis and Optimization of Permanent Magnet-Assisted Sync..:

, In: 2023 26th International Conference on Electrical Machines and Systems (ICEMS),
Lu, Jin-Ping ; Wan, Wen-Jie ; Lan, Yu-Hua.. - p. 561-566 , 2023
 
?
2

Surgical Instruments of Cleft Lip and Palate:

, In: Atlas of Cleft Lip and Palate & Facial Deformity Surgery,
 
?
3

A Research on the Steganography Capacity of the Reed-Solomo..:

, In: 2007 International Conference on Computational Intelligence and Security Workshops (CISW 2007),
 
?
4

A method of optimum product platform parameters planning:

, In: 2007 IEEE International Conference on Industrial Engineering and Engineering Management,
Zhao, Ling-xuan ; Jiang, Ping ; Wang, Xiao-yun.. - p. None , 2007
 
?
5

Case Study of SIMS Analysis on Insulators:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Wang, Yun ; Ong, Kian Kok ; Teo, Han Wei... - p. 1-4 , 2023
 
?
6

Research on the input-output evaluation method of power gri..:

, In: 2022 4th International Academic Exchange Conference on Science and Technology Innovation (IAECST),
Zhang, Yuhong ; Yang, Jie ; Wang, Chao.. - p. 436-439 , 2022
 
?
7

Contributors:

, In: Human Reproductive and Prenatal Genetics,
Aggarwal, Vimla ; Barber, T.M. ; Becker, Christian M.... - p. xiii-xix , 2023
 
?
8

A combined simulation and experimental study on cracking an..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Bin ; Lyu, Guang-Chao ; Wang, Hong-Guang... - p. 2046-2053 , 2023
 
?
9

Research on Operation State Evaluation of Power Plant Key T..:

, In: 2023 International Conference on Cyber-Physical Social Intelligence (ICCSI),
Yong-Ping, Gu ; Juan-Yun, Chen ; Xue-Wu, Wang... - p. 610-615 , 2023
 
?
10

A Comprehensive Study of Crack Initiation and Delamination ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wang, Hong-Guang ; Lyu, Guang-Chao ; Deng, Yun-Kai... - p. 1459-1464 , 2022
 
?
11

Large-area Die Attachment and the Surface Finish Effect on ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Chun-Meng ; Hou, Bin ; Deng, Yun-Kai.. - p. 1-6 , 2022
 
?
12

Moisture Desorption and Hygro-Vapor-Thermal Induced Interfa..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zheng, Long ; Deng, Yun-Kai ; Wang, Hong-Guang... - p. 1-5 , 2022
 
?
13

Compatible Equivalence Checking of X-Valued Circuits:

, In: 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD),
Wang, Yu-Neng ; Luo, Yun-Rong ; Chien, Po-Chun... - p. 1-9 , 2021
 
?
14

IMU-based Smart Knee Pad for Walking Distance and Stride Co..:

, In: 2020 21st International Symposium on Quality Electronic Design (ISQED),
Wang, Teng-Chia ; Chang, Yan-Ping ; Chen, Chun-Jui... - p. 173-178 , 2020
 
?
15

Mitigating SYN flooding Attack and ARP Spoofing in SDN Data..:

, In: 2020 21st Asia-Pacific Network Operations and Management Symposium (APNOMS),
Lin, Ting-Yu ; Wu, Jhen-Ping ; Hung, Pei-Hsuan... - p. 114-119 , 2020
 
1-15