E-LIB Suche - Ergebnisse für: Yang-Chin Kao

1

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024

Link: https://doi.org/10.23919..

2

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023

Link: https://doi.org/10.23919..

3

Board-Level Drop Reliability Analysis for Fine-Pitch BGA Pa..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),

Lai, Wei-Hong ; Yang, Hung-Chun ; Hsu, Meng-Chi.. - p. 97-100 , 2023

Link: https://doi.org/10.1109/..

4

Development and Application of the Moisture-Dependent Visco..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Yang, Chia-Ming ; Chiu, Tz-Cheng ; Yin, Wei-Jie... - p. 746-753 , 2022

Link: https://doi.org/10.1109/..

5

Single-Photon-Emission Computed Tomography Studies with Dop..:

, In: Neuropathology of Drug Addictions and Substance Misuse,

Lin, Shih-Hsien ; Chen, Kao Chin ; Yang, Yen Kuang - p. 966-973 , 2016

Link: https://doi.org/10.1016/..

6

Toward Free Head Motion for Visible-Spectrum Gaze Tracking ..:

, In: 2021 IEEE International Conference on Consumer Electronics (ICCE),

Kao, Wen-Chung ; Cheng, Pei-Ting ; Chiu, Yi-Chin... - p. 1-2 , 2021

Link: https://doi.org/10.1109/..

7

Quality Evaluation via PPG on the AVFs of Hemodialysis Pati..:

, In: 2019 IEEE SENSORS,

Chiang, Pei-Yu ; Chao, Paul C.-P. ; Tu, Tse-Yi... - p. 1-4 , 2019

Link: https://doi.org/10.1109/..

8

A Chinese Oral Question-and-Answering System Based on LSTM:

, In: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW),

Chen, Kuan-Hung ; Kao, Jui-I ; Wu, Chia-Hung.. - p. 1-2 , 2019

Link: https://doi.org/10.1109/..

9

A cooperative MAC protocol in multi-channel wireless ad hoc..:

, In: 2011 7th International Wireless Communications and Mobile Computing Conference,

Shih, Tsung-Chin ; Kao, Chien-Chi ; Yang, Shun-Ren - p. 1831-1836 , 2011

Link: https://doi.org/10.1109/..

10

Optimal Broadcast in All-Port Wormhole-Routed Hypercubes:

, In: 1994 International Conference on Parallel Processing Vol. 3,

Ching-Tien Ho, Ching-Tien Ho ; Ming-Yang Kao, Ming-Yang Kao - p. None , 1994

Link: https://doi.org/10.1109/..

11

Flotation stability analysis of the immersed tubes in Kaohs..:

, In: OCEANS 82,

Su-Zon Dan ; Chin-Seng Kao - p. 685,686,687,688 , 1982

Link: https://doi.org/10.1109/..

12

Evaluation of Vapor Pressure Induced Debonding Failure in F..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Chen, Bo-Shuo ; Chiu, Tz-Cheng ; Yin, Wei-Jie.. - p. 150-156 , 2024

Link: https://doi.org/10.1109/..

13

Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Shih, Meng-Kai ; Ke, Zih-Jun ; Yen, Chun-Yu.. - p. 153-154 , 2024

Link: https://doi.org/10.23919..

14

Semiconductor Fan-Out Polymer Adhesion on Physical Vapor De..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Lin, Nien-Chun ; Shih, Hsin-Chih ; Tsai, Ching-I... - p. 179-180 , 2024

Link: https://doi.org/10.23919..

15

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024

Link: https://doi.org/10.1109/..