Ani, Ismail Che
175  Ergebnisse:
Personensuche X
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3

Intermetallic Compound Thickness of Ball Grid Array Solder ..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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4

Effects of Underfill Materials on Behavior of Intermetallic..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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5

Reflow Optimization Process: Thermal Stress Using Numerical..:

Ani, F. Che ; Jalar, A. ; Ismail, R....
Arabian Journal for Science and Engineering.  40 (2015)  6 - p. 1669-1679 , 2015
 
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6

Undissolved gold in fine-pitch BGA solder joint under therm..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
Journal of Materials Science: Materials in Electronics.  35 (2024)  12 - p. , 2024
 
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7

The influence of Fe2O3 nano-reinforced SAC lead-free solder..:

Che Ani, F. ; Jalar, A. ; Saad, A. A....
The International Journal of Advanced Manufacturing Technology.  96 (2018)  1-4 - p. 717-733 , 2018
 
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9

Backward Compatibility Solder Joint Formation at High Peak ..:

Che Ani, F. ; Jalar, A. ; Ismail, R....
Arabian Journal for Science and Engineering.  41 (2015)  5 - p. 1813-1823 , 2015
 
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14

Effect of Different S AC Based Nanoparticles Types on the R..:

M. A. Fatah M. Mukhtar ; A. Abas ; M. S. Haslinda...
http://jafmonline.net/JournalArchive/download?file_ID=49927&issue_ID=1002.  , 2019
 
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15

TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu ..:

Che Ani, F ; Jalar, A ; Ismail, R...
https://journal.utem.edu.my/index.php/jamt/article/view/4296/3403.  , 2018
 
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