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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:
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2024 15th German Microwave Conference (GeMiC) ,
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In-Package Characterization of Dielectrics Using Ring Reson..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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3D Freeform Antenna-in-Package Approach for FOWLP:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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A Closer Look to Fan-out Panel Level Packaging:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Application of Machine Learning Methods for Process Optimiz..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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A novel FOWLP method to integrate delicate MEMS components:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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Packaging Platform for low to medium Power Packages:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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High-Resolution Printing of Redistribution Layers for Fan-O..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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Mold based D-band slotted SIW bandpass filter:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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In-situ infrared spectroscopy for chemical analysis in elec..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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SiC Fan-out Wafer Level Package for High Power Application:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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