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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
2
Effect of Rapid Thermal Fatigue on Microstructure and Prope..:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
3
Effect of Ag content on microstructure and fatigue crack of..:
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ACM SIGGRAPH 2024 Educator's Forum ,
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Integrating Independent Contributions in a Game Programming..:
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ACM SIGGRAPH 2024 Immersive Pavilion ,
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