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2024 IEEE International Reliability Physics Symposium (IRPS) ,
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Non-conducting Hot carrier temperature activation and tempe..:
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ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) ,
2
40-nm RFSOI technology exhibiting 90fs RON × COFF and fT/fM..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
3
Insight Into HCI Reliability on I/O Nitrided Devices:
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2023 IEEE International Integrated Reliability Workshop (IIRW) ,
4
Modulation Of HCI in I/O analog devices Through Process Spe..:
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2022 International Electron Devices Meeting (IEDM) ,
5
0.13 μm HR SiGe BiCMOS Technology exhibiting 169 fs Ron x C..:
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2021 IEEE International Reliability Physics Symposium (IRPS) ,
6
HCI Temperature sense effect from 180nm to 28nm nodes:
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2020 IEEE International Reliability Physics Symposium (IRPS) ,
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