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X
King, Ya Chin
1962  Ergebnisse:
englisch X
Personensuche X
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1

A novel channel-program–erase technique with substrate tran..:

Hsu, Tzu-Hsuan ; King, Ya Chin ; Wu, Jau-Yi...
Solid-State Electronics.  51 (2007)  11-12 - p. 1523-1528 , 2007
Link: https://doi.org/10.1016/..
 
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2

High-density via RRAM cell with multi-level setting by curr..:

Hsieh, Yu-Cheng ; Lin, Yu-Cheng ; Huang, Yao-Hung...
Discover Nano.  19 (2024)  1 - p. , 2024
Link: https://doi.org/10.1186/..
 
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3

A Study of Physical Unclonable Function by Dielectric Break..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Geng-Shiu ; King, Ya-Chin ; Lin, Chrong-Jung - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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4

Complementary Detectors for DUV Sensing by CMOS Logic Techn..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Huang, Ting-Kai ; Yeh, Hsin-Hung ; Shih, Jiaw-Ren.. - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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5

A New Ultra-Low Voltage Metal Fuse for High Density OTP App..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wang, Li-Yu ; Chen, Kuan-Ju ; Yuh, Perng-Fei... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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6

High Density Embedded 3D Stackable Via RRAM in Advanced MCU..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Huang, Yao-Hung ; Hsieh, Yu-Cheng ; Lin, Yu-Cheng... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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7

A study of hydrogen plasma-induced charging effect in EUV l..:

Huang, Yao-Hung ; Lin, Chrong Jung ; King, Ya-Chin
Discover Nano.  18 (2023)  1 - p. , 2023
Link: https://doi.org/10.1186/..
 
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8

CMOS compatible 2T pixel for on-wafer in-situ EUV detection:

Lin, Wei-Hwa ; Huang, Han-Lin ; Wu, Pin-Jiun..
Discover Nano.  18 (2023)  1 - p. , 2023
Link: https://doi.org/10.1186/..
 
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9

16nm FinFET DUV Detector Array in Fully Compatible FinFET L..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lin, Wei-Hwa ; Shih, Jiaw-Ren ; Chang, Jonathan... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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10

Characterization and Current Modeling of Stacked high-$\kap..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Chao, Gui-Sheng ; Chen, Wei-Hua ; Chen, Kuan-Ju.. - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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11

Offset-Via Anti-fuse by Cu BEOL Process in Advanced CMOS Te..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Yeh, Li-Yu ; Lin, Chrong-Jung ; King, Ya-Chin - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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12

Design of Versatile Top‐Down Transfer by Thermal Release Ta..:

Shen, Ying-Chun ; Wu, Bang-Kai ; Tsai, Tsung-Shun...
Small Science.  4 (2023)  2 - p. , 2023
Link: https://doi.org/10.1002/..
 
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13

Embedded Micro-detectors for EUV Exposure Control in FinFET..:

Wang, Chien-Ping ; Lin, Burn Jeng ; Wu, Pin-Jiun...
Nanoscale Research Letters.  17 (2022)  1 - p. , 2022
Link: https://doi.org/10.1186/..
 
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14

Pure CMOS embedded Artificial Synaptic Device (eASD) for Hi..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Yu, Hsin-Yuan ; Huang, Yao-Hung ; Chih, Yue-Der... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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15

Self-Inhibit Complementary Cells by High-κ Metal Gate Trans..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Lee, Wang-Yi ; Yeh, Chang-Pei ; King, Ya-Chin. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
1-15