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Smet, Vanessa
43  Ergebnisse:
englisch X
Personensuche X
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1

A Study of Chip-Package Interaction with All-Copper Interco..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sosa, Ramon A. ; Surillo, Emanuel Torres ; Molina-Mangual, Christian. - p. 1841-1847 , 2024
Link: https://doi.org/10.1109/..
 
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2

Bayesian Optimization of Large Glass Package Architecture f..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Surillo, Emanuel Torres ; Sosa, Ramon A. ; Molina, Christian... - p. 246-253 , 2024
Link: https://doi.org/10.1109/..
 
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3

Mitigating Cracking from RDL Stress in Glass Substrates wit..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Molina-Mangual, Christian ; Surillo, Emanuel Torres ; Nedumthakady, Nithin. - p. 1552-1557 , 2024
Link: https://doi.org/10.1109/..
 
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4

Impact of Non-Coplanarities on Microstructure and Propertie..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Amirnasiri, Ali ; Sosa, Ramon A. ; Tian, Mengkun.. - p. 2298-2303 , 2024
Link: https://doi.org/10.1109/..
 
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5

Enabling Socketable BGAs with Eutectic-Forming Bi-based Coa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Jaewon ; Smet, Vanessa - p. 1137-1143 , 2024
Link: https://doi.org/10.1109/..
 
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6

Magneto-Assisted Graphene Reinforcement: A New Method to En..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nedumthakady, Nithin ; Bhaskar, Pragna ; Smet, Vanessa - p. 1135-1142 , 2023
Link: https://doi.org/10.1109/..
 
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7

A Multi-Objective, Machine-Learning-Based Optimization Meth..:

, In: 2023 IEEE Transportation Electrification Conference & Expo (ITEC),
Molina-Mangual, Christian ; Torres-Surillo, Emanuel ; Wong, Ryan. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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8

Intelligent Multi-Physics Design of 3-D Leadframe- based Si..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Torres-Surillo, Emanuel ; Molina-Mangual, Christian ; Smet, Vanessa - p. 1952-1958 , 2023
Link: https://doi.org/10.1109/..
 
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9

Anomalous evolution of topology in nanoporous copper under ..:

Shahane, Ninad ; Mohan, Kashyap ; Smet, Vanessa.
Materialia.  28 (2023)  - p. 101757 , 2023
Link: https://doi.org/10.1016/..
 
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10

High Performance, Multilayer Copper-Graphene Micro-Foam Wic..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Moss, Alex ; Antoniou, Antonia ; Smet, Vanessa - p. 2087-2092 , 2023
Link: https://doi.org/10.1109/..
 
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11

Reliability and Failure Analysis of Chip-to-Substrate Cu-Pi..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sosa, Ramon A. ; Antoniou, Antonia ; Smet, Vanessa - p. 318-323 , 2023
Link: https://doi.org/10.1109/..
 
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12

Demonstration of Glass-based 3D Package Architectures with ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ravichandran, Siddharth ; Smet, Vanessa ; Swaminathan, Madhavan. - p. 1114-1120 , 2022
Link: https://doi.org/10.1109/..
 
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13

Modeling and Design for System-Level Reliability and Warpag..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jayaram, Vidya ; Gupte, Omkar ; Smet, Vanessa - p. 1060-1067 , 2022
Link: https://doi.org/10.1109/..
 
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14

CYTOP for bonding highly oriented pyrolytic graphite to be ..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Vaca, Diego ; Smet, Vanessa ; Joshi, Yogendra. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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15

Solid-state diffusion studies of lead-free solders on gold ..:

Gupte, Omkar ; Murtagian, Gregorio ; Kathaperumal, Mohanalingam..
Journal of Materials Science: Materials in Electronics.  33 (2022)  10 - p. 7679-7690 , 2022
Link: https://doi.org/10.1007/..
 
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