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Wu, Tzong-Lin
1780  Ergebnisse:
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1

HBM3 PPA Performance Evaluation by TSV Model with Micro-Bum..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Huang, Li-Hsin ; Cheng, Yu-Ying ; Wu, Tzong-Lin - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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2

Accuracy Improvement in Calibration Method for Complex Mate..:

, In: 2023 Asia-Pacific Microwave Conference (APMC),
Su, Pei-Shin ; Huang, Li-Ching ; Wan, Li-Chien.. - p. 647-649 , 2023
Link: https://doi.org/10.1109/..
 
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3

Analysis and Design for Broadband Slot Transition from Micr..:

, In: 2022 International Symposium on Electromagnetic Compatibility – EMC Europe,
Li, Yen-Ching ; Ting, Cheng-Wu ; Liu, Chung-Yuan. - p. 687-690 , 2022
Link: https://doi.org/10.1109/..
 
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4

A planar High-efficient W-band Substrate-Integrated-Wavegui..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yi-Ting ; Kuo, Hung-Chun ; Wu, Po-I... - p. 93-97 , 2022
Link: https://doi.org/10.1109/..
 
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5

A Wideband Single-Cell Unidirectional Absorption Common-Mod..:

, In: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC),
Liu, Hsu-Wei ; Wu, Tzong-Lin - p. 13-15 , 2022
Link: https://doi.org/10.1109/..
 
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6

Extraction of Complex Permittivity of Dielectrics on Packag..:

, In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC),
Lin, Yi-Ting ; Kuo, Hung-Chun ; Wu, Po-I... - p. 564-569 , 2021
Link: https://doi.org/10.1109/..
 
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7

A Cost-efficient Air-Filled Substrate Integrated Ridge Wave..:

, In: 2020 IEEE/MTT-S International Microwave Symposium (IMS),
Ting, Cheng-Wu ; Chen, Siang ; Wu, Tzong-Lin - p. 165-168 , 2020
Link: https://doi.org/10.1109/..
 
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8

EMI Reduction Control Based on 8b/10b:

, In: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Weng, Pei-Yang ; Chou, Chiu-Chih ; Wu, Tzong-Lin - p. 609-613 , 2020
Link: https://doi.org/10.1109/..
 
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9

An Improved Method of Finding Complex Permittivity of Lossy..:

, In: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Liu, Ruei-Jhe ; Chou, Chiu-Chih ; Wu, Tzong-Lin - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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10

Power Distribution Network Modeling and Design of Re-Distri..:

, In: 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI),
Chan, Chao-Kai ; Wu, Tsung-Ming ; Wu, Meng-Lin... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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11

Improvement of Power and Signal Integrity through Layer Ass..:

, In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Weng, Pei-Yang ; Cheng, Chi-Hsuan ; Wu, Tzong-Lin... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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12

A mm-Wave Low-Loss Transition from Microstrip Line to Air-F..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Ting, Cheng-Wu ; Chen, Kao-Chi ; Chen, Siang. - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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13

Enhanced Power and Signal Integrity Through Layout Optimiza..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Weng, Pei-Yang ; Cheng, Chi-Hsuan ; Wu, Tzong-Lin... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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14

Miniaturized Quarter-Wavelength Resonator for Common-Mode F..:

, In: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC),
Liu, Hsu-Wei ; Cheng, Chi-Hsuan ; Wu, Tzong-Lin - p. 816-819 , 2019
Link: https://doi.org/10.23919..
 
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15

Fast and accurate yield rate prediction of PCB embedded com..:

, In: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC),
Lin, Yi-Ting ; Cheng, Chi-Hsuan ; Wu, Tzong-Lin - p. 542-545 , 2018
Link: https://doi.org/10.1109/..
 
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