Lau, Anna S.
9  Ergebnisse:
Personensuche X
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1

Chip scale package (CSP) 

design, materials, processes, reliability, and applications  Electronic packaging and interconnection series
Lau, John H. , 1999
Exemplar:  Zentrale: a elt 695 f/690
 
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2

8th International Conference on Hot-Wire CVD (Cat CVD) Proc.. 

Thin solid films ; volume 595, part B (2015)
Exemplar:  Zentrale:Magazinturm-E02 15z phy 957 jb/588-595
 
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3

Ziemlich beste Feinde 

Internationale Politik ; 75. Jahr, Nr. 1 (Januar/Februar 2020)
Exemplar:  Zentrale: z pol 700/300-75
 
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4

Information sharing in supply chains 

improving the performance of collaboration  Operations and technology management ; vol. 3
Exemplare:  TB BHV: wir 512/159; BB WiWi: 11a bwl 276/735
 
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6

Existence of the sectional capacity 

Memoirs of the American Mathematical Society ; no. 690
Exemplar:  Zentrale:E02 a mat 090 z/598
 
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7

Columbia anthology of modern Chinese literature 

Modern Asian literature series
Exemplar:  Zentrale:Magazinturm-E02 a ori 908/032
 
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8

Ts'ao Yü. The reluctant disciple of Chekhov and O'Neill. A.. 

Centre of Asian Studies. Series ; No. 2
Exemplar:  Zentrale:Magazinturm-E02 a ori 910 tsa 7/386
 
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