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Bösch, J.
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1

SOI pMOS drain leakage understanding based on TCAD and meas..:

, In: 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Bosch, D. ; Lheritier, P. ; Guyader, F.... - p. 65-68 , 2023
Link: https://doi.org/10.23919..
 
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2

3D sequential integration with Si CMOS stacked on 28nm indu..:

, In: 2023 International Electron Devices Meeting (IEDM),
Mota-Frutuoso, T. ; Lapras, V. ; Brunet, L.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

Doped Channel SOI pMOS TCAD Description Including Floating ..:

, In: 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Lacord, J. ; Boutayeb, A. ; Bosch, D.... - p. 69-72 , 2023
Link: https://doi.org/10.23919..
 
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4

SmartSiC™ for Manufacturing of SiC Power Devices:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Daval, N. ; Drouin, A. ; Biard, H.... - p. 85-87 , 2022
Link: https://doi.org/10.1109/..
 
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5

3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling..:

, In: 2022 International Electron Devices Meeting (IEDM),
Guyader, F. ; Batude, P. ; Malinge, P.... - p. 37.4.1-37.4.4 , 2022
Link: https://doi.org/10.1109/..
 
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6

First demonstration of low temperature $(\leq 500^{\circ}\m..:

, In: 2020 IEEE Symposium on VLSI Technology,
Fenouillet-Beranger, C. ; Brunet, L. ; Batude, P.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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7

Comparative experimental study of junctionless and inversio..:

, In: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Bosch, D. ; Colinge, J.P. ; Lugo, J.... - p. 126-127 , 2020
Link: https://doi.org/10.1109/..
 
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8

All-operation-regime characterization and modeling of drain..:

, In: 2020 IEEE Symposium on VLSI Technology,
Bosch, D. ; Colinge, J.P. ; Ghibaudo, G.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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9

Test-Based Modeling, Source Characterization and Dynamic Su..:

, In: Conference Proceedings of the Society for Experimental Mechanics Series; Dynamic Substructures, Volume 4,
Steenhoek, A. M. ; van der Kooij, M. W. ; Verhees, M. L. J... - p. 73-76 , 2019
Link: https://doi.org/10.1007/..
 
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10

Back-bias impact on variability and BTI for 3D-monolithic 1..:

, In: 2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS),
Bosch, D. ; Andrieu, F. ; Garros, X.... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

Novel Fine-Grain Back-Bias Assist Techniques for 14nm FDSOI..:

, In: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA),
Bosch, D. ; Andrieu, F. ; Ciampolini, L.... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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12

Laser Processing For 3D Junctionless Transistor Fabrication:

, In: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S),
Bosch, D. ; Alba, P. Acosta ; Kerdiles, S.... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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13

Seasonal Dependence of SMAP Radiometer-Based Soil Moisture ..:

, In: IGARSS 2019 - 2019 IEEE International Geoscience and Remote Sensing Symposium,
Colliander, A. ; McNairn, H. ; Thibeault, M.... - p. 5320-5323 , 2019
Link: https://doi.org/10.1109/..
 
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14

A Method for Assessing SMAP Core Validation Site Scaling Bi..:

, In: IGARSS 2019 - 2019 IEEE International Geoscience and Remote Sensing Symposium,
Whitcomb, J. ; Bosch, D. ; Holifield-Collins, C.... - p. 6174-6177 , 2019
Link: https://doi.org/10.1109/..
 
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15

Viruses:

, In: Foodborne Diseases,
Koopmans, M. ; Bosch, A. ; Le Guyader, S. - p. 289-303 , 2017
Link: https://doi.org/10.1016/..
 
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