Bak, T.
30  Ergebnisse:
Personensuche X
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2

Contributor contact details:

, In: Materials for Energy Conversion Devices,
Sorrell, C.C. ; Sugihara, S. ; Nowotny, J.... - p. xi-xiv , 2005
 
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3

Defect disorder, transport and photoelectrochemical propert..:

, In: Materials for Energy Conversion Devices,
NOWOTNY, J ; SORRELL, C C ; BAK, T. - p. 84-119 , 2005
 
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5

Contributors:

, In: Advances in Wind Turbine Blade Design and Materials,
Bacharoudis, K. ; Bak, Christian ; Borst, M.S.... - p. xiii-xiv , 2023
 
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6

Procedure for parameter identification and validation of go..:

, In: 7th International Hybrid Power Plants & Systems Workshop (HYB 2023),
Tróndheim, H. M. ; da Silva, F. F. ; Bak, C. L.... - p. None , 2023
 
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7

Contributors:

, In: Coir Fiber and its Composites,
 
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8

28nm CIS-Compatible Embedded STT-MRAM for Frame Buffer Memo..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lee, K. ; Kim, D. S. ; Bak, J. H.... - p. 2.1.1-2.1.4 , 2021
 
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9

Robustness Verification of Semantic Segmentation Neural Net..:

, In: Computer Aided Verification; Lecture Notes in Computer Science,
Tran, Hoang-Dung ; Pal, Neelanjana ; Musau, Patrick... - p. 263-286 , 2021
 
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10

NNV: The Neural Network Verification Tool for Deep Neural N..:

, In: Computer Aided Verification; Lecture Notes in Computer Science,
 
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11

Improved Geometric Path Enumeration for Verifying ReLU Neur..:

, In: Computer Aided Verification; Lecture Notes in Computer Science,
 
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12

Demo: The Neural Network Verification (NNV) Tool:

, In: 2020 IEEE Workshop on Design Automation for CPS and IoT (DESTION),
 
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13

28-nm 0.08 mm2/Mb Embedded MRAM for Frame Buffer Memory:

, In: 2020 IEEE International Electron Devices Meeting (IEDM),
Han, S. H. ; Lee, J. M. ; Shin, H. M.... - p. 11.2.1-11.2.4 , 2020
 
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14

Verification of Deep Convolutional Neural Networks Using Im..:

, In: Computer Aided Verification; Lecture Notes in Computer Science,
 
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15

Partial Discharges of High Frequency Transformer for Space ..:

, In: Lecture Notes in Electrical Engineering; Proceedings of the 21st International Symposium on High Voltage Engineering,
 
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