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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Key Technologies and Design Aspects for Wafer Level Packagi..:
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2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
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Thermal Test Vehicle for HPC – System Level Approach for In..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
3D Freeform Antenna-in-Package Approach for FOWLP:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
5
A Closer Look to Fan-out Panel Level Packaging:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Panel Level Packaging – Where are the Technology Limits?:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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Miniaturized Sensor Modules for under Water Applications re..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
8
Packaging Platform for low to medium Power Packages:
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2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
9
Fan-Out Wafer and Panel Level Packaging - A Platform for 3D..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
10
Fan-out Wafer Level Packaging of GaN Components for RF Appl..:
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Advances in Experimental Medicine and Biology; Reverse Phase Protein Arrays ,
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Lysate Preparation for Reverse Phase Protein Arrays:
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2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) ,
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The ZuSE-KI-Mobil AI Accelerator SoC: Overview and a Functi..:
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