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X
Beyer, Gabriella V.
21  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Electrical analysis of unbalanced Flash memory array constr..:

, In: 2009 10th Annual Non-Volatile Memory Technology Symposium (NVMTS),
Seidel, K. ; Muller, T. ; Brandt, T.... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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2

Contributors:

, In: Blood Banking and Transfusion Medicine,
Adams, Sharon ; Alving, Barbara ; Anderson, Kenneth C.... - p. vii-xiii , 2007
Link: https://doi.org/10.1016/..
 
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3

Contributors:

, In: Cardiac Electrophysiology,
ACKERMAN, MICHAEL J. ; AGUEL, FELIPE ; ALBERTE-LISTA, CESAR... - p. iii-xvi , 2004
Link: https://doi.org/10.1016/..
 
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4

List of contributors:

, In: Translational Sports Medicine,
Abboud, Joseph ; Akhnoukh, Kyrillos M. ; Alexandrov, Alexander... - p. xiii-xix , 2023
Link: https://doi.org/10.1016/..
 
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5

List of contributors:

, In: Biological and Environmental Hazards, Risks, and Disasters,
Acharya, Hem Raj ; Adriaansen, Chris ; Alftine, Kathryn J.... - p. xi-xiii , 2023
Link: https://doi.org/10.1016/..
 
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6

List of Contributors:

, In: Diastology,
Andersen, Øyvind Senstad ; Anderson, Bonita A. ; Appleton, Christopher P.... - p. v-viii , 2021
Link: https://doi.org/10.1016/..
 
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7

Thermal, Mechanical and Reliability assessment of Hybrid bo..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Cherman, V. ; Van Huylenbroeck, S. ; Lofrano, M.... - p. 548-553 , 2020
Link: https://doi.org/10.1109/..
 
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8

Novell embedded microbump approach for die-to-die and wafer..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Derakhshandeh, J. ; Beyne, E. ; Capuz, G.... - p. 1-6 , 2019
Link: https://doi.org/10.23919..
 
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9

List of Contributors:

, In: Fate and Impact of Microplastics in Marine Ecosystems,
Abbas, B. ; Abreu, A. ; Adams, R.... - p. 189-219 , 2017
Link: https://doi.org/10.1016/..
 
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10

Contributors:

, In: Biological and Environmental Hazards, Risks, and Disasters,
Adriaansen, Chris ; Alftine, Kathryn J. ; Angerer, Jay P.... - p. xvii-xviii , 2016
Link: https://doi.org/10.1016/..
 
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11

List of Contributors:

, In: Allergy, Immunity and Tolerance in Early Childhood,
Aalberse, Rob C. ; Ahrens, Birgit ; Allen, Katrina... - p. xi-xiv , 2016
Link: https://doi.org/10.1016/..
 
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12

List of contributors:

, In: Laser Surface Engineering,
Aoyagi, N. ; Assunção, C.M. ; Beyer, E.... - p. xiii-xvi , 2015
Link: https://doi.org/10.1016/..
 
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13

Process development to enable 3D IC multi-tier die bond for..:

, In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC),
Hu, Y. H. ; Liu, C. S. ; Chen, M. T.... - p. 572-575 , 2014
Link: https://doi.org/10.1109/..
 
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14

On the behaviour of weighted multi-recombination evolution ..:

, In: Proceedings of the 11th Annual conference on Genetic and evolutionary computation,
Arnold, Dirk V. ; Beyer, Hans-Georg ; Melkozerov, Alexander - p. 483-490 , 2009
Link: https://dl.acm.org/doi/1..
 
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15

Molecular engineering for future device structures: self-as..:

, In: 2007 Digest of papers Microprocesses and Nanotechnology,
Whelan, C.M. ; Caro, A. Maestre ; Clemente, F.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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