Personensuche
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Thermomechanical Degradation of Sintered Copper under High-..:
, In:
?
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
2
Novel Low Temperature and Low Pressure Sintering of ADAS Ra..:
, In:
?
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
3
Understanding Cu Sintering and Its Role on Corrosion Behavi..:
, In:
?
2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ,
4
Correlation between the characteristics of printed sinter p..:
, In:
?
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
5
Reliability of Copper Sintered Interconnects Under Extreme ..:
, In:
?
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
6
Rapid Sintering of Inkjet Printed Cu Complex Inks Using Las..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
7
Low cost copper based sintered interconnect material for op..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
8
Investigation Of Stress Generated By Interconnection Proces..:
, In:
?
2022 International Conference on Electronics Packaging (ICEP) ,
9
Effect of binders on the performance of copper sintering pa..:
, In:
?
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
10
Development of an In-Line Capable Transient Thermal Analysi..:
, In:
?
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
11
Finite Element simulations and Raman measurements to invest..:
, In:
?
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
12
Copper die bonding using copper formate based pastes with α..:
, In:
?
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
13
Investigation of Thermomechanical Local Stress Induced in A..:
, In:
?
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
14
Hybrid Cu particle paste with surface-modified particles fo..:
, In:
?
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
15