Bowers, Jake W.
67  Ergebnisse:
Personensuche X
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1

Optimization of Back-Contact Diffusion Barrier for Solution..:

, In: 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC),
 
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2

Co-Sputtered Sn-Doped ZnO Thin Film n-Type Layers for Incor..:

, In: 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC),
 
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3

SnO2 Buffer Layers for High Efficiency CdSeTe/CdTe Devices:

, In: 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC),
 
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4

19.5% Efficient CdSeTe/CdTe Solar Cells Using ZnO Buffer La..:

, In: 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC),
Kujovic, Luksa ; Liu, Xiaolei ; Togay, Mustafa... - p. 1-3 , 2023
 
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5

Extracting Electrical Properties of CdTe, CdSeTe and CdSe T..:

, In: 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC),
 
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6

Ga-doping of MZO in CdSeTe/CdTe Thin Film Solar Cells:

, In: 2022 IEEE 49th Photovoltaics Specialists Conference (PVSC),
Togay, Mustafa ; Shimpi, Tushar ; Walajabad, Sampath S.... - p. 0658-0660 , 2022
 
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7

Tuning the band gap of magnesium zinc oxide to enhance band..:

, In: 2022 IEEE 49th Photovoltaics Specialists Conference (PVSC),
 
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8

Comparison of Cadmium Selenide Thin Films Deposited by Chem..:

, In: 2020 47th IEEE Photovoltaic Specialists Conference (PVSC),
 
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9

Chemical bath deposition of thin film CdSe layers for use i..:

, In: 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC),
 
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10

Extrinsic Doping of Amine-Thiol Solution-Processed Cu(In,Ga..:

, In: 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC),
Welch, Liam M. ; Ulicna, Sona ; Togay, Mustafa... - p. 1867-1871 , 2019
 
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11

Variation of Cu Content of Sprayed Cu(In, Ga)(S,Se)2 Solar ..:

, In: 2017 IEEE 44th Photovoltaic Specialist Conference (PVSC),
 
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12

Voices from the Field: Exploring Connections Between Design..:

, In: Understanding Innovation; Design Thinking Research,
 
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13

Design Thinking as a Catalyst and Support for Sustainabilit..:

, In: Understanding Innovation; Design Thinking Research,
 
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15

UX Methods as Transformative Institutional Change: Stacey A..:

, In: 2022 IEEE International Professional Communication Conference (ProComm),
 
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