Castellazzi, Am
57  Ergebnisse:
Personensuche X
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1

Assessment of POL Technology for SiC-based Integrated Modul..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Vardi, H. ; Lee, Y. ; Castellazzi, A. - p. 3706-3712 , 2024
 
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2

Regenerative Halbach-motor traction drive powered by an act..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Lee, Y. ; Castellazzi, A. ; Domae, S.. - p. 4194-4199 , 2024
 
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3

Dual switching-frequency hybrid Si-SiC Y-Inverter:

, In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia),
Jaber, H. J. ; Horie, K. ; Domae, S.. - p. 757-763 , 2023
 
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4

IMS-based integrated SiC-MOSFET bidirectional switches for ..:

, In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia),
Lee, Y. ; Aviles, S. ; Duchesne, C... - p. 45-52 , 2023
 
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5

SiC MOSFETs soft and hard failure modes: functional analysi..:

, In: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Richardeau, F. ; Boige, F. ; Castellazzi, A.... - p. 170-173 , 2020
 
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6

3-D FEM Investigation on Electrical Ruggedness of Double-Si..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Scognamillo, C. ; Catalano, A. P. ; Trani, R... - p. 1-4 , 2020
 
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7

Stress-induced Vertical Deformations in state-of-the-art Po..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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8

Optimization of Thermal Vias Design in PCB-Based Power Circ..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Catalano, A. P. ; Trani, R. ; Scognamillo, C... - p. 1-5 , 2020
 
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9

Damage accumulation in GaN GITs exposed to repetitive short..:

, In: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD),
D'Aniello, F. ; Fayyaz, A. ; Castellazzi, A... - p. 451-454 , 2019
 
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10

SPICE modeling and dynamic electrothermal simulation of SiC..:

, In: 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD),
d'Alessandro, V. ; Magnani, A. ; Riccio, M.... - p. 285-288 , 2014
 
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11

Design and test of a PCB Rogowski coil for very high dI/dt ..:

, In: 2012 15th International Power Electronics and Motion Control Conference (EPE/PEMC),
Ahmed, A. ; Coulbeck, L. ; Castellazzi, A.. - p. DS1a.2-1-DS1a.2-4 , 2012
 
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12

Optimum component technology selection for an expulsive win..:

, In: 5th IET International Conference on Power Electronics, Machines and Drives (PEMD 2010),
 
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13

Bridging the Scale Gap Between Ground Deformation and Gravi..:

, In: Remote Sensing for Characterization of Geohazards and Natural Resources; Springer Remote Sensing/Photogrammetry,
 
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14

Enhancing Electrical Ruggedness in Double-Sided Cooled Powe..:

, In: 2024 19th Conference on Ph.D Research in Microelectronics and Electronics (PRIME),
 
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15

A Study of Pulse Density Modulation to GaN Y-Inverter:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Gautam, Prakash ; Lee, Yonghwa ; Takahashi, Ryo. - p. 4498-4503 , 2024
 
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