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2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) ,
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Assessment of POL Technology for SiC-based Integrated Modul..:
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2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) ,
2
Regenerative Halbach-motor traction drive powered by an act..:
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2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia) ,
3
Dual switching-frequency hybrid Si-SiC Y-Inverter:
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2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia) ,
4
IMS-based integrated SiC-MOSFET bidirectional switches for ..:
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2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
5
SiC MOSFETs soft and hard failure modes: functional analysi..:
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
6
3-D FEM Investigation on Electrical Ruggedness of Double-Si..:
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
7
Stress-induced Vertical Deformations in state-of-the-art Po..:
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
8
Optimization of Thermal Vias Design in PCB-Based Power Circ..:
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2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
9
Damage accumulation in GaN GITs exposed to repetitive short..:
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2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD) ,
10
SPICE modeling and dynamic electrothermal simulation of SiC..:
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2012 15th International Power Electronics and Motion Control Conference (EPE/PEMC) ,
11
Design and test of a PCB Rogowski coil for very high dI/dt ..:
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5th IET International Conference on Power Electronics, Machines and Drives (PEMD 2010) ,
12
Optimum component technology selection for an expulsive win..:
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Remote Sensing for Characterization of Geohazards and Natural Resources; Springer Remote Sensing/Photogrammetry ,
13
Bridging the Scale Gap Between Ground Deformation and Gravi..:
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2024 19th Conference on Ph.D Research in Microelectronics and Electronics (PRIME) ,
14
Enhancing Electrical Ruggedness in Double-Sided Cooled Powe..:
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2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) ,
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