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2022 IEEE International Conference on Signal Processing and Communications (SPCOM) ,
1
Investigating Synchronized Optical Ballistocardiography vs ..:
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Lecture Notes in Electrical Engineering; Proceedings of the 11th International Conference on Robotics, Vision, Signal Processing and Power Applications ,
2
AFCGA as Preferable Intelligent Tuning Method to Reduce the..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
Vertical Stacking of Heterogeneous Chiplets of Duplexer on ..:
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Advances in Civil Engineering Materials; Lecture Notes in Civil Engineering ,
4
Properties of Cement-Coated Brick Aggregate Concrete:
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2023 IEEE Symposium on Industrial Electronics & Applications (ISIEA) ,
5
Development of an IoT-Enabled Automated Marine Sand Washing..:
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2023 IEEE International Conference on Image Processing (ICIP) ,
6
Pairwise Feature Learning for Unseen Plant Disease Recognit..:
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2022 IEEE 9th International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA) ,
7
Model Study for Outdoor Data Transmission Performance:
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2022 IEEE 9th International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA) ,
8
Development and Application of Outdoor Router Cost Estimati..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
9
Demonstration of Vertically Integrated POP using FOWLP Appr..:
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2020 13th International UNIMAS Engineering Conference (EnCon) ,
10
Review of Temperature and Humidity Impacts on RF Signals:
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2020 13th International UNIMAS Engineering Conference (EnCon) ,
11
Parametric Model Study for Outdoor Routers Cost Estimation:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
12
Double Mold Antenna in Package for 77 GHz Automotive Radar:
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The Advances in Civil Engineering Materials; Lecture Notes in Civil Engineering ,
13
A Review on Prefab Industrialised Building System Modular C..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
14
3D Stacking of Heterogeneous Chiplets on Modified FOWLP Pla..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
15
Assembly process characterization of 3D Stacking of Heterog..:
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