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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
1
U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Effici..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
2
2.1 A 4nm 3.4GHz Tri-Gear Fully Out-of-Order ARMv9.2 CPU Su..:
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2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) ,
3
Design of High-RA STT-MRAM for Future Energy-Efficient In-M..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
4
U-MRAM: Transistor-Less, High-Speed (10 ns), Low-Voltage (0..:
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2023 Optical Fiber Communications Conference and Exhibition (OFC) ,
5
In0.52Al0.48As Based Single Photon Avalanche Diodes with Mu..:
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2022 8th International Conference on Automation, Robotics and Applications (ICARA) ,
6
A Deep Learning Methodology to Detect Trojaned AI-based DDo..:
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2022 International Electron Devices Meeting (IEDM) ,
7
Highly Reliable, Scalable, and High-Yield HfZrOx FRAM by Ba..:
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2020 Design, Automation & Test in Europe Conference & Exhibition (DATE) ,
8
Accuracy Tolerant Neural Networks Under Aggressive Power Op..:
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Proceedings of the 23rd Conference on Design, Automation and Test in Europe ,
9
Accuracy tolerant neural networks under aggressive power op..:
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Proceedings of the International Conference on Computer-Aided Design ,
10
Searching toward pareto-optimal device-aware neural archite..:
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2017 14th International Symposium on Pervasive Systems, Algorithms and Networks & 2017 11th International Conference on Frontier of Computer Science and Technology & 2017 Third International Symposium of Creative Computing (ISPAN-FCST-ISCC) ,
11
A Supervised Hybrid Classifier for Brain Tissues and White ..:
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Proceedings of the 51st Annual Design Automation Conference ,
12
Contactless Stacked-die Testing for Pre-bond Interposers:
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Proceedings of the conference on Design, Automation & Test in Europe ,
13
Package geometric aware thermal analysis by infrared-radiat..:
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2014 Design, Automation & Test in Europe Conference & Exhibition (DATE) ,
14
Package geometric aware thermal analysis by infrared-radiat..:
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Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design ,
15
A novel sequential circuit optimization with clock gating l..:
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