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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Advanced Fanout Packaging Technology for Hybrid Substrate I..:
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Seminal graphics : pioneering efforts that shaped the field ,
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A progressive refinement approach to fast radiosity image g..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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High Power Thermal Test Vehicle with 2-Phase Cooling for AI..:
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2024 IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW) ,
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Toward a Holistic Performance Evaluation of Large Language ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Study of Solder Resist Crack Resistance for Flip Chip Ball ..:
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2023 International Conference on Machine Learning and Applications (ICMLA) ,
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Transferable Graph Neural Fingerprint Models for Quick Resp..:
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Communications in Computer and Information Science; HCI International 2023 Posters ,
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Industry 5.0: Intelligent Sensor Based Autonomous Control S..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Study of Parameter Tuning for the Curing Condition on ABF T..:
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2022 52nd Annual IEEE/IFIP International Conference on Dependable Systems and Networks - Supplemental Volume (DSN-S) ,
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On the Scalability of HeapCheck:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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Amber: A 367 GOPS, 538 GOPS/W 16nm SoC with a Coarse-Graine..:
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2022 IEEE Hot Chips 34 Symposium (HCS) ,
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Amber: Coarse-Grained Reconfigurable Array-Based SoC for De..:
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SC21: International Conference for High Performance Computing, Networking, Storage and Analysis ,
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Error-Controlled, Progressive, and Adaptable Retrieval of S..:
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2021 51st Annual IEEE/IFIP International Conference on Dependable Systems and Networks - Supplemental Volume (DSN-S) ,
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