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Chen, Rick
66  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Advanced Fanout Packaging Technology for Hybrid Substrate I..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Lee, Teck Chong ; Chen, Rick... - p. 1362-1370 , 2022
Link: https://doi.org/10.1109/..
 
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2

A progressive refinement approach to fast radiosity image g..:

, In: Seminal graphics,
Cohen, Michael F. ; Chen, Shenchang Rick ; Wallace, John R.. - p. 167-176 , 1998
Link: https://doi.org/10.1145/..
 
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3

A progressive refinement approach to fast radiosity image g..:

, In: Seminal graphics : pioneering efforts that shaped the field,
Cohen, Michael F. ; Chen, Shenchang Rick ; Wallace, John R.. - p. 167-176 , 1998
Link: https://dl.acm.org/doi/1..
 
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4

Contributors:

, In: Concepts and Models for Drug Permeability Studies,
Agarwal, Priyanka ; Andrade, Fernanda ; Araújo, Francisca... - p. xvii-xxii , 2024
Link: https://doi.org/10.1016/..
 
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5

High Power Thermal Test Vehicle with 2-Phase Cooling for AI..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Liu, Yang ; Basavanhally, Nagesh ; Earnshaw, Mark... - p. 1030-1035 , 2024
Link: https://doi.org/10.1109/..
 
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6

Toward a Holistic Performance Evaluation of Large Language ..:

, In: 2024 IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW),
Emani, Murali ; Foreman, Sam ; Sastry, Varuni... - p. 1-10 , 2024
Link: https://doi.org/10.1109/..
 
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7

Study of Solder Resist Crack Resistance for Flip Chip Ball ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Eric ; Ye, Rick ; Teng, Wen-Yu.. - p. 1531-1535 , 2023
Link: https://doi.org/10.1109/..
 
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8

Transferable Graph Neural Fingerprint Models for Quick Resp..:

, In: 2023 International Conference on Machine Learning and Applications (ICMLA),
Chen, Wei ; Ren, Yihui ; Kagawa, Ai... - p. 800-807 , 2023
Link: https://doi.org/10.1109/..
 
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9

Industry 5.0: Intelligent Sensor Based Autonomous Control S..:

, In: Communications in Computer and Information Science; HCI International 2023 Posters,
Chen, Jerry ; Chang, Rick ; Peng, Bon.. - p. 449-453 , 2023
Link: https://doi.org/10.1007/..
 
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10

Study of Parameter Tuning for the Curing Condition on ABF T..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ye, Rick ; Chen, Eric ; Teng, Wen-Yu.. - p. 1987-1990 , 2022
Link: https://doi.org/10.1109/..
 
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11

On the Scalability of HeapCheck:

, In: 2022 52nd Annual IEEE/IFIP International Conference on Dependable Systems and Networks - Supplemental Volume (DSN-S),
Boivie, Rick ; Saileshwar, Gururaj ; Chen, Tong.. - p. 15-18 , 2022
Link: https://doi.org/10.1109/..
 
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12

Amber: A 367 GOPS, 538 GOPS/W 16nm SoC with a Coarse-Graine..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Carsello, Alex ; Feng, Kathleen ; Kong, Taeyoung... - p. 70-71 , 2022
Link: https://doi.org/10.1109/..
 
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13

Amber: Coarse-Grained Reconfigurable Array-Based SoC for De..:

, In: 2022 IEEE Hot Chips 34 Symposium (HCS),
Feng, Kathleen ; Carsello, Alex ; Kong, Taeyoung... - p. 1-30 , 2022
Link: https://doi.org/10.1109/..
 
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14

Error-Controlled, Progressive, and Adaptable Retrieval of S..:

, In: SC21: International Conference for High Performance Computing, Networking, Storage and Analysis,
Liang, Xin ; Gong, Qian ; Chen, Jieyang... - p. 1-14 , 2021
Link: https://doi.org/10.1145/..
 
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15

Hardware Support for Low-Cost Memory Safety:

, In: 2021 51st Annual IEEE/IFIP International Conference on Dependable Systems and Networks - Supplemental Volume (DSN-S),
Boivie, Rick ; Saileshwar, Gururaj ; Chen, Tong.. - p. 57-60 , 2021
Link: https://doi.org/10.1109/..
 
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